IP Library › Granted Patent US 8,882,296
Granted Patent B2
US 8,882,296 · App. 13/438,066 · Granted Nov 11, 2014

Light emitting diode module and display device using the same light emitting diode module

Inventors: Sheng-Wen Chen (Hsin-Chu, TW); Wen-Kuei Liu (Hsin-Chu, TW); Yu-Min Hung (Hsin-Chu, TW); Tsai-Fen Lee (Hsin-Chu, TW); Yung-Hsiang Tsao (Hsin-Chu, TW)
Assignee: Au Optronics Corp.
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Quick Facts
Patent No.
US 8,882,296
App. No.
13/438,066
Granted
Nov 11, 2014
Kind
B2
Abstract

A light emitting diode (LED) module and a display device adopting the same LED module are provided. The LED module includes a circuit substrate, a LED chip, a connector and a conductive line. The LED chip has at least three pins, and the LED chip is fixed on the circuit substrate through the pins, wherein one of the pins is defined as a no connection (NC) pin. The connector includes a non-conductive housing, at least one fixing pin and a conductor. The fixing pin is connected to the non-conductive housing, and the non-conductive housing is fixed on the circuit substrate through the said at least one fixing pin. A part of the non-conductive housing is covered with the conductor. The conductive line is disposed on the circuit substrate and is electrically connected between the conductor and the NC pin.

Claims (47)

1. A light emitting diode module, comprising:

a circuit substrate;

a first light emitting diode chip, having at least three pins and being fixed on the circuit substrate through the pins, and one of the pins being defined as a first no connection pin;

a connector, comprising:

a non-conductive housing;

at least one fixing pin, connected to the non-conductive housing, wherein the non-conductive housing is fixed on the circuit substrate through the said at least one fixing pin; and

a conductor, covering a part of the non-conductive housing; and

a conductive line, disposed on the circuit substrate and electrically connected between the conductor and the first no connection pin.

2. The light emitting diode module according to claim 1 , wherein the non-conductive housing has an opening with four outer sides, and one of the outer sides is fixed between the circuit substrate and the opening through the said at least one fixing pin, and the conductor covers at least two outer sides of the remaining outer sides and covers at least part areas of the covered outer sides.

3. The light emitting diode module according to claim 1 , wherein the connector further comprises:

a first power source pin, disposed on the circuit substrate and electrically connected to one of the remaining two pins of the first light emitting diode chip through the circuit substrate; and

a second power source pin, disposed on the circuit substrate and electrically connected to the other one of the remaining two pins of the first light emitting diode chip through the circuit substrate.

4. The light emitting diode module according to claim 1 , further comprising:

a second light emitting diode chip, having at least three pins and being disposed on the circuit substrate through the pins, and one of the pins being defined as a second no connection pin, wherein the second no connection pin is electrically connected to the first no connection pin through the conductive line.

5. The light emitting diode module according to claim 1 , wherein the light emitting diode module is connected to a ground through the conductor.

6. The light emitting diode module according to claim 1 , wherein the fixing pins are connected between the conductive line and the conductor.

7. A light emitting diode module, comprising:

a circuit substrate, having a first surface and a second surface, and the circuit substrate further having at least one through hole;

a first light emitting diode chip, having at least three pins and being fixed on the circuit substrate through the pins, and one of the pins being defined as a first no connection pin;

a connector, comprising at least one fixing pin and being disposed on the circuit substrate;

at least one conductive element, disposed in the said at least one through hole and electrically connected to the fixing pin; and

a conductive line, disposed on the circuit substrate and electrically connected between the fixing pin and the first no connection pin.

8. The light emitting diode module according to claim 7 , wherein the connector further comprises a non-conductive housing, the non-conductive housing is fixed on the first surface of the circuit substrate through the said at least one fixing pin, the non-conductive housing has a opening with four outer sides, and one of the four outer sides is fixed between the first surface of the circuit substrate and the opening through the said at least one fixing pin.

9. The light emitting diode module according to claim 7 , wherein the connector further comprises:

a first power source pin, disposed on the circuit substrate and electrically connected to one of the remaining two pins of the first light emitting diode chip through the circuit substrate; and

a second power source pin, disposed on the circuit substrate and electrically connected to the other one of the remaining two pins of the first light emitting diode chip through the circuit substrate.

10. The light emitting diode module according to claim 7 , further comprising:

a second light emitting diode chip, having at least three pins and being fixed on the circuit substrate through the pins, and one of the pins being defined as a second no connection pin;

wherein the second no connection pin is electrically connected to the first no connection pin through the conductive line.

11. The light emitting diode module according to claim 7 , wherein the light emitting diode module is connected to a ground through the said at least one conductive element.

12. A display device, comprising:

a display panel;

a light emitting diode module for providing light source to the display panel, the light emitting diode comprising:

a circuit substrate, having a first surface and a second surface, and the circuit substrate further having at least one through hole;

a first light emitting diode chip, having at least three pins and being fixed on the circuit substrate through the pins, and one of the pins being defined as a first no connection pin;

a connector, comprising at least one fixing pin and being disposed on the circuit substrate;

at least one conductive element, disposed in the said at least one through hole and electrically connected to the fixing pin; and

a conductive line, disposed on the circuit substrate and electrically connected between the fixing pin and the first no connection pin; and

a metal backplane, electrically connected to at least one conductive element.

13. The display device according to claim 12 , wherein the connector further comprises a non-conductive housing, the non-conductive housing is fixed on the first surface of the circuit substrate through the said at least one fixing pin, the non-conductive housing has an opening with four outer sides, and one of the four outer sides is fixed between the first surface of the circuit substrate and the opening through the said at least one fixing pin.

14. The display device according to claim 12 , wherein the connector further comprises:

a first power source pin, disposed on the circuit substrate and electrically connected to one of the remaining two pins of the first light emitting diode chip through the circuit substrate; and

a second power source pin, disposed on the circuit substrate and electrically connected to the other one of the remaining two pins of the first light emitting diode chip through the circuit substrate.

15. The display device according to claim 12 , further comprising:

a second light emitting diode chip, having at least three pins and being fixed on the circuit substrate through the pins, and one of the pins being defined as a second no connection pin;

wherein the second no connection pin is electrically connected to the first no connection pin through the conductive line.

16. The display device according to claim 12 , wherein the light emitting diode module is connected to a ground through the said at least one conductive element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2012
From: CHEN, SHENG-WEN; LIU, WEN-KUEI; HUNG, YU-MIN; LEE, TSAI-FEN; TSAO, YUNG-HSIANG
To: AU OPTRONICS CORP.
Reel/Frame 027978/0123 →
Priority Claims (1)
TW 100131558 A · Sep 1, 2011 · national
Continuity (1)
Related Publication 20130056769A1 · Mar 7, 2013