Nonvolatile semiconductor memory device and method for manufacturing same

1. A nonvolatile semiconductor memory device comprising:

a stacked structural unit including a plurality of electrode films and a plurality of inter-electrode insulating films alternately stacked in a first direction;

a first selection gate electrode stacked on the stacked structural unit in the first direction;

a first semiconductor pillar piercing the stacked structural unit and the first selection gate electrode in the first direction;

a first memory unit provided at an intersection of each of the plurality of electrode films and the first semiconductor pillar; and

a first selection gate insulating film provided between the first semiconductor pillar and the first selection gate electrode,

the first selection gate electrode including

a first silicon layer having a first face perpendicular to the first direction, and

a first silicide layer provided on the first face, a direction from the first silicide layer toward the first face being parallel to the first direction,

wherein both of the first silicon layer and the first silicide layer contact the first selection gate insulating film, and

wherein a distance between the first silicon layer and the first semiconductor pillar is the same as a distance between the first silicide layer and the first semiconductor pillar.

2. The device according to claim 1 , wherein the first silicide layer includes a silicide including at least one selected from the group consisting of tungsten, molybdenum, titanium, cobalt, nickel, tantalum, vanadium, and niobium.

3. The device according to claim 1 , wherein the first silicon layer includes amorphous silicon including an impurity or polysilicon including an impurity.

4. The device according to claim 1 , wherein

the first silicon layer has a second face intersecting a plane perpendicular to the first direction, and

the first selection gate electrode further includes a second silicide layer provided on the second face and a direction from the second silicide layer toward the second face is parallel to the plane perpendicular to the first direction.

5. The device according to claim 4 , wherein a material included in the first silicide layer and a material included in the second silicide layer are substantially identical to each other.

6. The device according to claim 1 , further comprising a substrate,

the stacked structural unit and the first selection gate electrode being provided above the substrate; and

the first face perpendicular to the first direction being an upper face of the first selection gate electrode.

7. The device according to claim 1 , wherein the first semiconductor pillar includes a third silicide layer provided at an end of the first semiconductor pillar in a direction from the stacked structural unit to the first selection gate electrode.

8. The device according to claim 7 , wherein the third silicide layer is formed collectively with the first silicide layer.

9. The device according to claim 1 , wherein each of the plurality of electrode films includes at least one of amorphous silicon including an impurity and polysilicon including an impurity.

10. The device according to claim 1 , wherein each of the plurality of inter-electrode insulating films and the first selection gate insulating film include silicon oxide.

11. The device according to claim 1 , wherein the first memory unit includes:

a first memory layer provided between each of the plurality of electrode films and the first semiconductor pillar;

a first inner-side insulating film provided between the first memory layer and the first semiconductor pillar; and

a first outer-side insulating film provided between each of the plurality of electrode films and the first memory layer.

12. The device according to claim 11 , wherein the first inner-side insulating film and the first outer-side insulating film include silicon oxide.

13. The device according to claim 11 , wherein the first memory layer includes a single layer film of one selected from the group consisting of silicon nitride, silicon oxynitride, aluminum oxide, aluminum oxynitride, hafnia, hafnium aluminate, hafnia nitride, hafnium nitride aluminate, hafnium silicate, hafnium nitride silicate, lanthanum oxide, and lanthanum aluminate or a stacked film made of a plurality selected from the group.

14. The device according to claim 11 , wherein the first memory layer includes silicon nitride.

15. The device according to claim 1 , further comprising an insulative core unit, the first semiconductor pillar having a tubular shape aligning in the first direction, and

the insulative core unit being disposed inside the first semiconductor pillar.

16. The device according to claim 15 , wherein the core unit includes silicon nitride.

17. The device according to claim 1 , further comprising:

a second selection gate electrode stacked on the stacked structural unit in the first direction;

a second semiconductor pillar piercing the stacked structural unit and the second selection gate electrode in the first direction;

a second memory unit provided at an intersection of each of the plurality of electrode films and the second semiconductor pillar;

a second selection gate insulating film provided between the second semiconductor pillar and the second selection gate electrode; and

a connection portion connecting the first semiconductor pillar and the second semiconductor pillar on an opposite side of the stacked structural unit from the first selection gate electrode and the second selection gate electrode,

the second selection gate electrode including

a second silicon layer having a third face perpendicular to the first direction, the third silicide layer included in a plane including the first face, and

a third silicide layer provided on the third face, a direction from the third silicide layer toward the third face being perpendicular to the first direction.