Nitride compound semiconductor device and manufacturing method thereof
A nitride compound semiconductor device includes: a substrate; a buffer layer formed on the substrate and including a plurality of composite layers each layered of: a first layer formed of a nitride compound semiconductor; and a second layer formed of a nitride compound semiconductor containing aluminum and having a lattice constant smaller than a lattice constant of the first layer; a semiconductor operating layer formed on the buffer layer; and a plurality of electrodes formed on the semiconductor operating layer. At least one of the second layers has oxygen added therein.
1. A nitride compound semiconductor device, comprising:
a substrate;
a buffer layer formed on the substrate and including a plurality of composite layers each layered of:
a first layer formed of a nitride compound semiconductor; and
a second layer formed of a nitride compound semiconductor containing aluminum and having a lattice constant smaller than a lattice constant of the first layer;
a semiconductor operating layer formed on the buffer layer; and
a plurality of electrodes formed on the semiconductor operating layer, wherein
at least one of the second layers has oxygen added therein.
2. The nitride compound semiconductor device according to claim 1 , wherein the first layer is formed of GaN and the second layer is formed of AlN.
3. The nitride compound semiconductor device according to claim 1 , wherein an oxygen concentration of the second layer is 1×10 19 cm −3 or greater.
4. The nitride compound semiconductor device according to claim 3 , wherein an oxygen concentration of the second layer is smaller than 1×10 20 cm −3 .
5. The nitride compound semiconductor device according to claim 1 , wherein at least the second layer of the composite layer that receives the highest voltage when a voltage is applied between the electrodes, has oxygen added therein.
6. The nitride compound semiconductor device according to claim 1 , wherein an interface between the first layer and the second layer of at least one of the composite layers, has two-dimensional electron gas generated thereat.
7. The nitride compound semiconductor device according to claim 6 , wherein the second layer of the composite layer located closest to the semiconductor operating layer among the composite layers in which the two-dimensional electron gas is formed, has oxygen added therein.
8. The nitride compound semiconductor device according to claim 1 , wherein the nitride compound semiconductor device is a field effect transistor or a Schottky barrier diode.
9. A method of manufacturing a nitride compound semiconductor device, the method comprising:
forming, on a substrate, a buffer layer including a plurality of composite layers each layered of:
a first layer formed of a nitride compound semiconductor; and
a second layer formed of a nitride compound semiconductor containing aluminum and having a lattice constant smaller than a lattice constant of the first layer;
forming a semiconductor operating layer on the buffer layer; and
forming a plurality of electrodes on the semiconductor operating layer, wherein
the forming of the buffer layer includes adding oxygen in at least one of the second layers.
10. The method of manufacturing a nitride compound semiconductor device according to claim 9 , wherein the forming of the buffer layer includes adding oxygen in at least one of the second layers by:
forming the first layer and the second layer using a metalorganic chemical vapor deposition (MOCVD) method; and
mixing at least one of oxygen gas and a gas containing oxygen, with a source gas that is used in performing epitaxial growth by the MOCVD method.