MOM capacitor having local interconnect metal plates and related method
According to one exemplary embodiment, a metal-oxide-metal (MOM) capacitor in a semiconductor die comprises a first plurality of capacitor plates and a second plurality of capacitor plates sharing a plane parallel to and below a plane of a first metallization layer of the semiconductor die. The MOM capacitor further comprises a local interlayer dielectric between the first plurality of capacitor plates and the second plurality of capacitor plates. The first and second plurality of capacitor plates are made from a local interconnect metal for connecting devices formed in a device layer of the semiconductor die situated below the first metallization layer.
1. A metal-oxide-metal (MOM) capacitor in a semiconductor die, said MOM capacitor comprising:
a first plurality of capacitor plates and a second plurality of capacitor plates in a MOM capacitor region situated laterally adjacent a transistor region, said first and second plurality of capacitor plates sharing a plane parallel to and below a plane of a first metallization layer of said semiconductor die;
a local interlayer dielectric between said first plurality of capacitor plates and said second plurality of capacitor plates; and
said first and second plurality of capacitor plates comprised of a local interconnect metal for connecting devices formed in a device layer situated below said first metallization layer, wherein said first and second plurality of capacitor plates do not overlie said transistor region, said first and second plurality of capacitor plates are formed at a same layer as a local interconnect metal body which provides a direct connection to a gate in the transistor region, the gate being formed on a gate dielectric layer, and at least one dielectric layer is disposed below the plurality of capacitor plates and between the local interlayer dielectric and a dielectric layer in which the gate is formed, the dielectric layer in which the gate is formed being separate from the gate dielectric layer.
2. The MOM capacitor of claim 1 , further comprising a first capacitor runner for interconnecting said first plurality of capacitor plates, and a second capacitor runner for interconnecting said second plurality of capacitor plates, said first and second capacitor runners comprising another local interconnect metal for providing connections among said devices formed in said device layer.
3. The MOM capacitor of claim 1 , wherein said first plurality of capacitor plates further comprise a lower local interconnect metal, and said second plurality of capacitor plates further comprise said lower local interconnect metal.
4. The MOM capacitor of claim 3 , further comprising a first capacitor runner for interconnecting said first plurality of capacitor plates, and a second capacitor runner for interconnecting said second plurality of capacitor plates, said first and second capacitor runners comprising another local interconnect metal for providing connections among said devices formed in said device layer.
5. The MOM capacitor of claim 1 , wherein said local interconnect metal comprises a refractory metal.
6. The MOM capacitor of claim 1 , wherein said local interconnect metal comprises copper.
7. The MOM capacitor of claim 1 , wherein said local interlayer dielectric comprises silicon oxide.
8. The MOM capacitor of claim 1 , wherein said local interlayer dielectric comprises silicon nitride.
9. The MOM capacitor of claim 1 , wherein said local interlayer dielectric has a dielectric constant greater than or equal to approximately 3.9 and less than approximately 5.0.
10. The MOM capacitor of claim 1 , wherein said first and second plurality of capacitor plates are situated over an isolation region formed in said device layer.