Solid-state imaging device and method of manufacturing the same
A solid-state imaging device includes a pixel region and a driving circuit region which are disposed on a semiconductor substrate, the pixel region being configured such that a photoelectric conversion unit and a signal scanning circuit unit are included and a matrix of unit pixels is disposed, and the driving circuit region being configured such that a driving circuit for driving the signal scanning circuit unit is disposed, a first pad which is provided on a peripheral region on the semiconductor substrate on a side of a light receiving surface, the light receiving surface being formed on a substrate surface which is opposite to a substrate surface where the signal scanning circuit unit is formed, and a second pad which is provided on a side where the signal scanning circuit unit is formed, and which is disposed only at a position overlapping the pixel region.
1. A solid-state imaging device comprising:
a pixel region and a driving circuit region which are disposed on a semiconductor substrate, the pixel region being configured such that a photoelectric conversion unit and a signal scanning circuit unit are included and a matrix of unit pixels is disposed, and the driving circuit region being configured such that a driving circuit for driving the signal scanning circuit unit is disposed;
a support substrate provided on the semiconductor substrate on a side where the signal scanning circuit unit is formed, the support substrate having a first main surface provided on a side of the semiconductor substrate, and a second main surface opposite to the first main surface;
a first via penetrating the support substrate and connected to a wiring in an interlayer insulating film provided on the semiconductor substrate;
a first pad which is provided on a peripheral region on the semiconductor substrate on a side of a light receiving surface, the light receiving surface being formed on a substrate surface which is opposite to a substrate surface where the signal scanning circuit unit is formed; and
a second pad which is provided on the second main surface of the support substrate, which is disposed at a position overlapping the pixel region in a thickness direction of the semiconductor substrate, which is connected to the first via, and to which an external member is connected,
wherein the first via, the second pad, and a bonding wire connected to the first via and the second pad are provided under the pixel region.
2. The device according to claim 1 , wherein the second pad is supplied with at least a reference potential.
3. The device according to claim 2 , wherein the signal scanning circuit unit includes at least a multilayer wiring, and includes an interlayer insulation film which is disposed between the semiconductor substrate and the support substrate, and
the device further comprises a first diffusion layer which is electrically connected to the second pad and is provided on the interlayer insulation film on the semiconductor substrate side in association with each of the unit pixels.
4. The device according to claim 3 , wherein the first diffusion layer is supplied with the reference potential, and has a lattice-shaped plan-view layout.
5. The device according to claim 3 , wherein the first diffusion layer is supplied with the reference potential, and has a comb-shaped plan-view layout.
6. The device according to claim 2 , wherein the signal scanning circuit unit includes at least a multilayer wiring, and includes an interlayer insulation film which is disposed between the semiconductor substrate and the support substrate, and
the device further comprises a first diffusion layer and a second diffusion layer which are electrically connected to the second pad and are provided in the same layer level on the interlayer insulation film on the semiconductor substrate side in association with each of the unit pixels.
7. The device according to claim 6 , wherein the first diffusion layer is supplied with the reference potential, and has a lattice-shaped plan-view layout.
8. The device according to claim 7 , wherein the second diffusion layer is supplied with the reference potential, and has a comb-shaped plan-view layout.
9. The device according to claim 1 , further comprising a first wiring layer which is disposed in the signal scanning circuit unit and is electrically connected to the first pad, thereby to apply a power supply potential.
10. The device according to claim 9 , further comprising a second wiring layer which is disposed in the signal scanning circuit unit and is electrically connected to the second pad, thereby to apply a reference potential.
11. The device according to claim 1 , further comprising:
an antireflection film which is provided on the semiconductor substrate on a light illumination surface side;
a plurality of color filters which are provided on the antireflection film in association with the unit pixels; and
a plurality of micro-lenses which are provided on the color filters in association with the unit pixels.
12. The device according to claim 1 , wherein the external member is a solder ball.
13. The device according to claim 1 , wherein the external member is a bonding wire.
14. The device according to claim 1 , further comprising a second via penetrating the semiconductor substrate.