Heat dissipation system for power module
Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
1. A heat dissipation system for a power module, the heat dissipation system comprising:
first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage;
first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and
first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
2. The heat dissipation system as set forth in claim 1 , wherein the first and second inflow lines are extended to one side of the first and second heat dissipation plates.
3. The heat dissipation system as set forth in claim 1 , wherein, when the first and second heat dissipation plates and the first and second inflow lines are plural in number, the plurality of first and second heat dissipation plates and the first and second inflow lines are combined with each other in a stacking type.
4. The heat dissipation system as set forth in claim 3 , wherein the plurality of first and second inflow lines are all connected to the first and second inlets, respectively, while the first and second inflow lines are separated from each other.
5. The heat dissipation system as set forth in claim 1 , further comprising a plurality of heat dissipation fins formed on a cooling medium flow passage formation plane of the first and second heat dissipation plates.
6. The heat dissipation system as set forth in claim 5 , further comprising a partition member formed between the plurality of heat dissipation fins on the cooling medium flow passage formation plane of the first and second heat dissipation plates.
7. The heat dissipation system as set forth in claim 1 , further comprising a controller controlling fluxes or flow rates of the cooling media flowing into the first and second inlets.
8. The heat dissipation system as set forth in claim 7 , wherein the controller controls the fluxes or flow rates of the cooling media flowing into the first and second inlets to be different from each other.
9. The heat dissipation system as set forth in claim 1 , further comprising an insulating layer formed on the first and second heat dissipation plates.
10. The heat dissipation system as set forth in claim 9 , further comprising semiconductor devices formed on the insulating layer.
11. The heat dissipation system as set forth in claim 1 , further comprising an outlet formed at the other side of the first and second heat dissipation plates and extended to the cooling medium flow passage, to discharge the cooling media.
12. A heat dissipation system for a power module comprising a plurality of inflow lines and supplying cooling media to a plurality of inflow lines at different flow rates or fluxes.
13. The heat dissipation system as set forth in claim 12 , further comprising:
first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage;
first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and
first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
14. The heat dissipation system as set forth in claim 13 , further comprising a plurality of heat dissipation fins formed on a cooling medium flow passage formation plane of the first and second heat dissipation plates.
15. The heat dissipation system as set forth in claim 14 , further comprising a partition member formed between the plurality of heat dissipation fins on the cooling medium flow passage formation plane of the first and second heat dissipation plates.
16. The heat dissipation system as set forth in claim 13 , further comprising a controller controlling fluxes or flow rates of the cooling media flowing into the first ands second inlets.
17. The heat dissipation system as set forth in claim 13 , further comprising an insulating layer formed on the first and second heat dissipation plates.
18. The heat dissipation system as set forth in claim 17 , further comprising semiconductor devices formed on the insulating layer.