Method for bonding plastic micro chip
Disclosed is a method of bonding upper and lower substrates for manufacturing a plastic micro chip comprising the upper substrate, the lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates. According to the method, the upper and lower substrates are bonded by introducing an organic solvent between the upper and lower substrates. In addition, the invention provides a method of manufacturing a micro chip using the method and a micro chip manufactured according to the method. According to the invention, it is possible to easily and precisely bond the upper and lower substrates of the plastic micro chip.
1. A chip, comprising:
a first substrate;
a second substrate being provided on the first substrate;
a sample filling space being defined by the first substrate and the second substrate, the sample filling space being configured to receive a sample for testing;
a bonding region for bonding the first substrate and the second substrate; and
a fine channel extending around an outermost perimeter of the first substrate, the fine channel defining a groove extending around outermost edges of the first substrate, the fine channel having a surface that is hydrophilic to facilitate flow of a solvent in the fine channel, the solvent being used to bond the first and second substrates,
wherein the fine channel has a height that is sufficiently small to enable the solvent to flow through the fine channel by capillary action.
2. The chip according to claim 1 , wherein the first substrate and the second substrate are bonded by at least one compound selected from a group consisting of ketone, aromatic hydrocarbon, cyanoacrylate compound and halogenated hydrocarbon.
3. The chip according to claim 2 , wherein the first substrate and the second substrate are bonded by at least one compound selected from a group consisting of acetone, chloroform, methylene chloride, ethylcyanoacrylate and carbon tetrachloride.
4. The chip according to claim 1 , wherein the height of the fine channel is 100 μm or less.
5. The chip according to claim 1 , wherein the bonding region is transparent.
6. The chip according to claim 1 , wherein the first and second substrates includes at least one polymer selected from a group consisting of polycarbonate, polystyrene, polypropylene, polyethylene derivatives, polymethylmethacrylate and acryl-based plastic material.
7. The chip of claim 1 , wherein the chip is made of plastic.
8. The chip of claim 1 , wherein the first and second substrates include plastic, and
wherein the bonding region is defined between the outer perimeter of the first substrate and an outer perimeter of the sample filling space.
9. The chip of claim 8 , wherein the fine channel defines an outer extension of the bonding region.
10. The chip of claim 9 , wherein the surface of the fine channel is plasma-treated to make the surface more hydrophilic.
11. The chip of claim 1 , wherein the bonding region is hydrophilic to facilitate flow of the solvent from the fine channel to be distributed sufficiently in the bonding region by capillary action for bonding the first and second substrates.