IP Library › Granted Patent US 8,901,683
Granted Patent B2
US 8,901,683 · App. 13/934,661 · Granted Dec 2, 2014

Micro electro mechanical system (MEMS) microphone and fabrication method thereof

Inventor: Chang Han Je (Daejeon, KR)
Assignee: Electronics and Telecommunications Research Institute
B81B3/0018B81C1/00158
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Quick Facts
Patent No.
US 8,901,683
App. No.
13/934,661
Granted
Dec 2, 2014
Kind
B2
Abstract

Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a membrane and by decreasing membrane rigidity. A MEMS microphone according to the present disclosure includes a backplate formed on a substrate; an insulating layer formed on the substrate to surround the backplate; a membrane formed to be separate from above the backplate by a predetermined interval; a membrane supporting portion configured to connect the membrane to the substrate; and a buffering portion formed in a double spring structure between the membrane and the membrane supporting portion.

Claims (31)

1. A micro electro mechanical system (MEMS) microphone, comprising:

a backplate formed on a substrate;

an insulating layer formed on the substrate to surround the backplate;

a membrane formed to be separate from above the backplate by a predetermined interval;

a membrane supporting portion configured to connect the membrane to the substrate; and

a buffering portion formed in a double spring structure between the membrane and the membrane supporting portion.

2. The MEMS microphone of claim 1 , wherein the buffering portion comprises:

an inner spring connected to the membrane;

an outer spring connected to the membrane supporting portion; and

a spacer connected between the inner spring and the outer spring.

3. The MEMS microphone of claim 2 , further comprising:

a protruding portion formed on the bottom surface of the spacer.

4. The MEMS microphone of claim 2 , wherein the outer spring has rigidity smaller than the inner spring.

5. The MEMS microphone of claim 3 , wherein an addition of a height of the protruding portion and a height of the insulating portion is a distance maintaining gap.

6. A MEMS microphone, comprising:

a substrate having a first insulating layer;

a membrane formed on the substrate;

a membrane supporting portion configured to fix the membrane to the substrate;

a buffering portion formed in a double spring structure between the membrane and the membrane supporting portion; and

a backplate formed to be separate from above the membrane by a predetermined interval.

7. The MEMS microphone of claim 6 , wherein the buffering portion comprises:

an inner spring connected to the membrane;

an outer spring connected to the membrane supporting portion; and

a spacer connected between the inner spring and the outer spring.

8. The MEMS microphone of claim 7 , further comprising:

a second insulating layer attached on the bottom surface of the backplate; and

a protruding portion formed on the top surface of the spacer to face the second insulating layer.

9. The MEMS microphone of claim 7 , wherein the outer spring has rigidity smaller than the inner spring.

10. The MEMS microphone of claim 8 , wherein an addition of a height of the protruding portion and a height of the second insulating portion is a distance maintaining gap.

11. The MEMS microphone of claim 6 , further comprising:

a backplate supporting portion configured to fix the backplate to the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2013
From: JE, CHANG HAN
To: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Reel/Frame 030739/0708 →
Priority Claims (1)
KR 10-2012-0107761 · Sep 27, 2012 · national
Continuity (1)
Related Publication 20140084394A1 · Mar 27, 2014