3-D non-volatile memory device and method of manufacturing the same
A three dimensional (3-D) non-volatile memory device includes a pipe gate including a first pipe gate, a second pipe gate formed on the first pipe gate, and a first interlayer insulating layer interposed between the first pipe gate and the second pipe gate, word lines alternately stacked with second interlayer insulating layers on the pipe gate, a pipe channel buried within the pipe gate, and memory cell channels coupled to the pipe channel and arranged to pass through the word lines and the second interlayer insulating layers.
1. A three dimensional (3-D) non-volatile memory device, comprising:
a pipe gate including a first pipe gate, a second pipe gate formed on the first pipe gate, and a first interlayer insulating layer interposed between the first pipe gate and the second pipe gate;
word lines alternately stacked with second interlayer insulating layers on the pipe gate;
a pipe channel buried within the pipe gate and in direct contact with the first pipe gate; and
memory cell channels coupled to the pipe channel and arranged to pass through the word lines and the second interlayer insulating layers.
2. A three dimensional (3-D) non-volatile memory device, comprising:
a pipe gate including a first pipe gate, a second pipe gate formed on the first pipe gate, and a first interlayer insulating layer interposed between the first pipe gate and the second pipe gate;
word lines alternately stacked with second interlayer insulating layers on the pipe gate;
a pipe channel buried within the pipe gate and a part of the pipe channel extending into the first pipe gate to be directly coupled to the first pipe gate; and
memory cell channels coupled to the pipe channel and arranged to pass through the word lines and the second interlayer insulating layers.
3. The 3-D non-volatile memory device of claim 2 , further comprising a tunnel insulating layer, a charge trap layer, and a charge blocking layer that surround the pipe channel and the memory cell channels other than regions protruded into the first pipe gate.
4. The 3-D non-volatile memory device of claim 3 wherein the pipe channel and the memory cell channels comprise:
a first channel formed on the tunnel insulating layer, the charge trap layer, and the charge blocking layer; and
a second channel formed on the first channel, wherein a part of the second channel extends into the first pipe gate and is directly coupled to the first pipe gate.
5. The 3-D non-volatile memory device of claim 1 , wherein:
the first pipe gate comprises P type impurities,
the second pipe gate comprises N type impurities, and
the first pipe gate functions as a source of holes in an erase operation.
6. The 3-D non-volatile memory device of claim 1 , wherein the pipe channel and the memory cell channels has a pipe form having an open central region and includes:
an insulating layer buried in the open central region, and
conductive plugs buried in upper parts of the insulating layer of the open central region.