Electronic apparatus and manufacturing method
An electronic apparatus includes a main body, a hinge through which the main body is attached to a stand, a chassis including a support portion that is attached to the hinge, a vibrating component to which a bracket is attached, the vibrating component being attached to the support portion through the bracket, and a shielding member that is attached to the chassis to cover the chassis without coming into contact with the vibrating component.
1. An electronic apparatus comprising:
a main body;
a hinge through which the main body is attached to a stand;
a chassis including a support portion that is attached to the hinge;
a vibrating component to which a bracket is attached, the vibrating component being attached to the support portion through the bracket; and
a shielding member that is attached to the chassis to cover the chassis without coming into contact with the vibrating component,
wherein the bracket and shielding member are interdisposed between the hinge and the support portion, and
wherein the vibrating component is housed entirely in an area formed between the shielding member and a surface of the chassis.
2. The electronic apparatus according to claim 1 , wherein at least two of the bracket, the shielding member and the hinge are secured to the support portion.
3. The electronic apparatus according to claim 1 , wherein the vibrating component is disposed between the chassis and the shielding member with a space interposed therebetween.
4. The electronic apparatus according to claim 1 , wherein the vibrating component is supported by the bracket without coming into contact with the chassis and the shielding member.
5. The electronic apparatus according to claim 1 , wherein the hinge includes a hinge frame formed with a material that is at least twice as thick as the shielding member.
6. The electronic apparatus according to claim 1 , wherein the vibrating component is a hard disk drive unit.
7. The electronic apparatus of claim 1 , wherein the support portion comprises a pair of support walls which are erected orthogonally from a plane of the chassis, wherein the bracket, shielding member and hinge are all secured to the pair of support walls.
8. The electronic apparatus of claim 1 , wherein the hinge attaches to a rear surface of the shielding member.
9. A method of manufacturing an electronic apparatus, the method comprising:
forming a chassis including a support portion that supports a hinge through which a main body of the electronic apparatus is attached to a stand;
attaching a vibrating component to the support portion through a bracket attached to the vibrating component; and
attaching a shielding member to the chassis such that the shielding member covers the chassis without coming into contact with the vibrating component,
wherein the bracket and shielding member are interdisposed between the hinge and the support portion, and
wherein the vibrating component is housed entirely in an area formed between the shielding member and a surface of the chassis.
10. The method of claim 9 , wherein the support portion comprises a pair of support walls which are erected orthogonally from a plane of the chassis, wherein the bracket, shielding member and hinge are all secured to the pair of support walls.
11. The method of claim 7 , wherein the hinge attaches to a rear surface of the shielding member.