Wafer level LED package and method of fabricating the same
Disclosed are a light emitting diode (LED) package and a method of fabricating the same. The LED package includes a first substrate, a semiconductor stack disposed on a front surface of the first substrate, a second substrate including a first lead electrode and a second lead electrode, a plurality of connectors electrically connecting the semiconductor stack to the first and second lead electrodes, and a wavelength converter covering a rear surface of the first substrate. The semiconductor stack includes a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer.
1. A light emitting diode (LED) package, comprising:
a first substrate;
a semiconductor stack disposed on a front surface of the first substrate, the semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer;
a second substrate comprising a first lead electrode and a second lead electrode;
a plurality of connectors electrically connecting the semiconductor stack to the first and second lead electrodes; and
a wavelength converter covering a rear surface of the first substrate.
2. The LED package of claim 1 , further comprising:
an underfill disposed between the first substrate and the second substrate.
3. The LED package of claim 2 , wherein the underfill comprises at least one of a phosphor and a filler.
4. The LED package of claim 2 , wherein the wavelength converter covers at least a portion of a lateral side of the underfill.
5. The LED package of claim 4 , further comprising:
a moisture barrier coating covering the wavelength converter.
6. The LED package of claim 5 , wherein the moisture barrier coating covers a lateral side of the underfill.
7. The LED package of claim 1 , further comprising:
a moisture barrier coating covering the wavelength converter.
8. The LED package of claim 7 , wherein the moisture barrier coating comprises an organic material layer and an inorganic material layer alternately laminated.
9. The LED package of claim 7 , wherein the wavelength converter fills a gap between the first substrate and the second substrate.
10. The LED package of claim 1 , wherein the wavelength converter comprises a phosphor-containing glass.
11. The LED package of claim 10 , wherein the glass is directly on the rear surface of the first substrate.
12. The LED package of claim 1 , wherein a rear surface of the first substrate is textured.
13. The LED package of claim 1 , wherein a lateral side of the first substrate is inclined with respect to a vertical direction of the rear surface of the first substrate.