IP Library Granted Patent US 8,917,219
Granted Patent B2
US 8,917,219 · App. 13/120,726 · Granted Dec 23, 2014

RFID transponder antenna

Inventors: Robert Semar (Dresden, DE); Michael Schaefer (Burghardswalde, DE); Marco Wagner (Dresden, DE); Henry Prescher (Dresden, DE)
Assignee: Smartrac Technology Dresden GmbH
H01Q1/2225G06K19/07749G06K19/07752G06K19/07779G06K19/07783
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Quick Facts
Patent No.
US 8,917,219
App. No.
13/120,726
Granted
Dec 23, 2014
Kind
B2
Abstract

An RFID transponder antenna has a carrier substrate and an auxiliary substrate. The carrier substrate is provided with a contact point for a first connection to an integrated circuit, and a first conductor path including at least two coil turns. A first end of the path forms a contact terminal for a second connection to the integrated circuit. The other end forms a connection point for an electrical connection to a second conductor path. The second path on the auxiliary substrate forms a bridge over the coil turns. The second conductor path has one end connected to the contact point, and another end connected to the connection point providing a permanent connection between the auxiliary substrate and/or the first conductor path, and the carrier substrate and/or second conductor path; the permanent connection being formed at least at one point lying between both ends of the auxiliary substrate.

Claims (7)

1. An RFID transponder antenna having a carrier substrate and an auxiliary substrate, wherein a first contact point for a first connection to an integrated circuit, and a first conductor path structure which forms at least two neighboring coil turns, each extending fully about a perimeter of the carrier substrate, are arranged on the carrier substrate, a first end of said first conductor path forms a second contact terminal for a second connection to the integrated circuit, an other end of the first conductor path forms a connection point for an electrical connection to a second conductor path arranged on the auxiliary substrate, said second conductor path forming a bridge over the at least two neighboring coil turns, the second conductor path having one end electrically connected to the first contact point, and another end electrically connected to the connection point, wherein the auxiliary substrate is arranged head-down in relation to a surface of the carrier substrate in such a manner that the at least two neighboring coil turns of the carrier substrate are crossed by the auxiliary substrate, and a permanent connection is provided between the auxiliary substrate and/or the second conductor path on one hand, and the carrier substrate and/or the first conductor path on an other hand, said permanent connection being formed at least at one point lying between both ends of the auxiliary substrate, and further comprising at least one support structure arranged on the carrier substrate and materially connected to the second conductor path, the support structure comprising a material body arranged outside of a first and inside of a second of said at least two neighboring coil turns.

2. An RFID transponder antenna according to claim 1 , wherein the support structure is produced from a same material as the first conductor path, and manufactured along with the first conductor path at a same time.

3. An RFID transponder antenna having a carrier substrate and an auxiliary substrate, wherein a first contact point for a first connection to an integrated circuit, and a first conductor path structure which forms at least two neighboring coil turns, each extending fully about a perimeter of the carrier substrate, are arranged on the carrier substrate, a first end of said first conductor path forms a second contact terminal for a second connection to the integrated circuit, an other end of the first conductor path forms a connection point for an electrical connection to a second conductor path arranged on the auxiliary substrate, said second conductor path forming a bridge over the at least two neighboring coil turns, the second conductor path having one end electrically connected to the first contact point, and another end electrically connected to the connection point , wherein the auxiliary substrate is arranged head-down in relation to a surface of the carrier substrate in such a manner that the at least two neighboring coil turns of the carrier substrate are crossed by the auxiliary substrate, and a permanent connection is provided between the auxiliary substrate and/or the second conductor path on one hand, and the carrier substrate and/or the first conductor path on an other hand, said permanent connection being formed at least at one point lying between both ends of the auxiliary substrate, further comprising at least one connection element arranged between the carrier substrate and the auxiliary substrate, said at least one connection element being materially connected to the carrier substrate and/or the first conductor path on one hand, and the auxiliary substrate and/or the second conductor path on an other hand.

4. An RFID transponder antenna according to claim 3 , wherein the at least one connection element is only large enough to electrically insulate an area where the carrier substrate and auxiliary substrate overlap.

5. An RFID transponder antenna according to claim 3 , wherein the at least one connection element is a same size or larger than the carrier substrate, areas of the at least one connection element which project beyond the carrier substrate are connected to two reinforcement layers in a materially-connected manner, said reinforcement layers covering the carrier substrate with the auxiliary substrate and the at least one connection element each from a different side, and both ends of the second conductor path are electrically connected to the first end of the first conductor path and to the first contact point via a perforation of the at least one connection element.

6. An RFID transponder antenna according to claim 3 , wherein the at least one connection element comprises a thermoplastic film.

7. An RFID transponder antenna according to claim 3 , wherein the at least one connection element comprises a non-conductive adhesive.

Assignments (3)
CHANGE OF NAME Recorded Dec 16, 2014
From: SMARTRAC TECHNOLOGY DRESDEN GMBH
To: SMARTRAC TECHNOLOGY GMBH
Reel/Frame 034648/0927 →
MERGER Recorded Oct 29, 2014
From: KSW MICROTEC AG
To: SMARTRAC TECHNOLOGY DRESDEN GMBH
Reel/Frame 034087/0208 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2011
From: SEMAR, ROBERT; SCHAEFER, MICHAEL; WAGNER, MARCO; PRESCHER, HENRY
To: KSW MICROTEC AG
Reel/Frame 026392/0077 →
Priority Claims (1)
DE 10 2008 048 948 · Sep 25, 2008 · national
Continuity (1)
Related Publication 20110267254A1 · Nov 3, 2011