Substrate processing apparatus
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.
1. A substrate processing method employing a substrate processing apparatus that is arranged adjacent to an exposure device that subjects a substrate to exposure processing by means of an immersion method, said substrate processing apparatus comprising a processing section that subjects the substrate to processing, and an interface that is provided adjacent to one end of said processing section for exchanging the substrate between said processing section and said exposure device,
the substrate processing method comprising the steps of:
forming a photosensitive film made of a photosensitive material on the substrate before said exposure processing in said processing section;
subjecting the substrate after said step of forming the photosensitive film and before said exposure processing to thermal processing in said processing section;
cleaning an edge of the substrate after said thermal processing and before said exposure processing using a brush such that a contaminant at the edge, on which the photosensitive film is not formed, of the substrate is physically stripped while horizontally holding the substrate by a holder, rotating the substrate held by the holder around an axis perpendicular to the substrate, and supplying pure water to the edge, on which the photosensitive film is not formed, of the substrate being rotated in said interface, immediately before said exposure processing by said exposure device; and
transporting the substrate after said step of cleaning the edge to said exposure device in said interface, wherein the brush does not come into contact with the photosensitive film formed by the step of forming the photosensitive film in said cleaning step.
2. The substrate processing method according to claim 1 , wherein said step of transporting the substrate to the exposure device includes the step of holding the substrate before said exposure processing with a first holder of said substrate processing apparatus and transporting the substrate to said exposure device, and the substrate processing method further comprises the step of holding the substrate after said exposure processing with a second holder of said substrate processing apparatus and transporting the substrate from said exposure device to said substrate processing apparatus.
3. The substrate processing method according to claim 2 , wherein said second holder is provided below said first holder.
4. The substrate processing method according to claim 1 , further comprising the step of forming a protective film on the substrate for protecting said photosensitive film after said thermal processing and before said step of cleaning the edge in said substrate processing apparatus.
5. The substrate processing method according to claim 4 , further comprising the step of removing said protective film from the substrate after said exposure processing in said substrate processing apparatus.
6. The substrate processing method according to claim 1 , further comprising the step of forming an anti-reflection film on the substrate before said step of forming the photosensitive film in said substrate processing apparatus.
7. The substrate processing method according to claim 1 , further comprising the step of subjecting the substrate after said exposure processing to development processing in said substrate processing apparatus.
8. The substrate processing method according to claim 1 , wherein said step of cleaning the edge of the substrate includes the steps of
holding the substrate after said thermal processing and before said exposure processing substantially horizontally;
rotating said substrate that is held around an axis perpendicular to the substrate;
cleaning the edge of said substrate that is rotated using a brush; and
correcting the position where the substrate is cleaned using the brush.