Compound semiconductor device and manufacturing method of the same
An AlGaN/GaN.HEMT includes, a compound semiconductor lamination structure; a p-type semiconductor layer formed on the compound semiconductor lamination structure; and a gate electrode formed on the p-type semiconductor layer, in which Mg being an inert element of p-GaN is introduced into both sides of the gate electrode at the p-type semiconductor layer, and introduced portions of Mg are inactivated.
1. A compound semiconductor device, comprising:
a compound semiconductor lamination structure;
a p-type semiconductor layer formed upward of the compound semiconductor lamination structure; and
a gate electrode formed upward of the p-type semiconductor layer,
wherein an inert element is introduced into portions of the p-type semiconductor layer on opposite sides of the gate electrode, causing the portions of the p-type semiconductor layer on opposite sides of the gate electrode to be inactivated, and resulting in the presence of a two-dimensional electron gas in regions of the compound semiconductor lamination structure that are below the portions of the p-type semiconductor layer on opposite sides of the gate electrode but not in a region of the compound semiconductor lamination structure that is below the gate electrode.
2. The compound semiconductor device according to claim 1 ,
wherein the inert element is introduced into a surface layer portion of the p-type semiconductor layer, and a non-introduced portion of the inert element remains downward of the surface layer portion of the p-type semiconductor layer.
3. The compound semiconductor device according to claim 1 , further comprising:
a protective insulating film that covers the portions of the p-type semiconductor layer on opposite sides of the gate electrode.
4. The compound semiconductor device according to claim 1 ,
wherein the inert element comprises argon (Ar), iron (Fe), phosphorus (P), oxygen (O 2 ) or boron (B) or any combination thereof.
5. A method of manufacturing a compound semiconductor device, comprising:
forming a compound semiconductor lamination structure;
forming a p-type semiconductor layer upward of the compound semiconductor lamination structure;
forming a gate electrode upward of the p-type semiconductor layer; and
inactivating portions of the p-type semiconductor layer on opposite sides of the gate electrode by introducing an inert element to the portions of the p-type semiconductor layer on opposite sides of the gate electrode, thereby resulting in the presence of a two-dimensional electron gas in regions of the compound semiconductor lamination structure that are below the portions of the p-type semiconductor layer on opposite sides of the gate electrode but not in a region of the compound semiconductor lamination structure that is below the gate electrode.
6. The method of manufacturing the compound semiconductor device according to claim 5 ,
wherein the inert element is introduced into a surface layer portion of the p-type semiconductor layer, and a non-introduced portion of the inert element remains downward of the surface layer portion.
7. The method of manufacturing the compound semiconductor device according to claim 5 , further comprising:
forming a protective insulating film on the p-type semiconductor layer,
wherein the inert element is introduced into the p-type semiconductor layer via the protective insulating film.
8. The method of manufacturing the compound semiconductor device according to claim 5 , further comprising:
forming a protective insulating film that covers portions of the p-type semiconductor layer on opposite sides of the gate electrode after the introducing of the inert element to the p-type semiconductor layer.
9. The method of manufacturing the compound semiconductor device according to claim 5 ,
wherein the inert element comprises argon (Ar), iron (Fe), phosphorus (P), oxygen (O 2 ) or boron (B) or any combination thereof.
10. A power supply device, comprising:
a transformer;
a high-pressure circuit and a low-pressure circuit that sandwich the transformer therebetween,
wherein the high-pressure circuit includes a transistor, and
the transistor includes:
a compound semiconductor lamination structure;
a p-type semiconductor layer formed upward of the compound semiconductor lamination structure; and
a gate electrode formed upward of the p-type semiconductor layer,
wherein an inert element is introduced into portions of the p-type semiconductor layer on opposite sides of the gate electrode, causing the portions of the p-type semiconductor layer on opposite sides of the gate electrode to be inactivated, and resulting in the presence of a two-dimensional electron gas in regions of the compound semiconductor lamination structure that are below the portions of the p-type semiconductor layer on opposite sides of the gate electrode but not in a region of the compound semiconductor lamination structure that is below the gate electrode.
11. The compound semiconductor device according to claim 1 , wherein the device comprises a source electrode and a drain electrode on opposite sides of the gate electrode, and the portions of the p-type semiconductor layer containing the inert element each extend from the gate electrode to the source or drain electrode.
12. The method of manufacturing the compound semiconductor device according to claim 5 , further comprising forming a source electrode and a drain electrode on opposite sides of the gate electrode, wherein the portions of the p-type semiconductor layer containing the inert element each extend from the gate electrode to the source or drain electrode.