Diode structures with controlled injection efficiency for fast switching
This invention discloses a semiconductor device disposed in a semiconductor substrate. The semiconductor device includes a first semiconductor layer of a first conductivity type on a first major surface. The semiconductor device further includes a second semiconductor layer of a second conductivity type on a second major surface opposite the first major surface. The semiconductor device further includes an injection efficiency controlling buffer layer of a first conductivity type disposed immediately below the second semiconductor layer to control the injection efficiency of the second semiconductor layer.
1. A diode device disposed in a semiconductor substrate comprising:
a heavily doped bottom layer of a first conductivity type supporting a doped buffer layer of the first conductivity type above the heavily doped bottom layer wherein the heavily doped bottom layer is in contact with an electrode of the diode device disposed below the bottom surface of the semiconductor substrate;
an additional buffer layer of the first conductivity type disposed above and more heavily doped than the buffer layer of the first conductivity wherein the additional buffer layer is disposed below a top semiconductor layer of a second conductivity type disposed at a top surface of said semiconductor substrate in contact with a Schottky contact layer as an electrode of the diode device;
a plurality of trenches opened from the top surface of the semiconductor having a trench depth vertically extending to a bottom of the additional buffer layer thus reducing an area of the top semiconductor layer of the second conductivity type below the Schottky contact layer; and
an upper lightly doped buffer layer of the first conductivity type disposed immediately below the additional buffer layer and above the doped buffer layer of the first conductivity type disposed above the heavily doped bottom layer and having a dopant concentration lower than the heavily doped bottom layer but higher than the doped buffer layer.
2. The diode device according to claim 1 , wherein:
the trenches are lined with a dielectric layer and filled with a trench-gate material of the second conductivity type.
3. The diode device according to claim 1 , wherein:
the semiconductor substrate is an N-type semiconductor substrate and the trenches are lined with a dielectric layer and filled with a P-type trench-gate material.
4. The diode device according to claim 1 , wherein:
the trenches are lined with a dielectric layer and filled with a trench-gate material directly contacting the Schottky contact layer.
5. The diode device according to claim 1 wherein:
the top semiconductor layer of the second conductivity type further comprises a segment disposed adjacent to only one of the trenches functioning as a contact region to the electrode of the diode device.
6. The diode device according to claim 1 wherein
the Schottky contact layer disposed on top of said semiconductor substrate is in contact with and electrically connected to said top semiconductor layer of the second conductivity and also contacting a gate filling material filled in said trenches.
7. The diode device according to claim 1 , wherein:
the heavily doped bottom layer of the first conductivity type is an N-type doped bottom layer in contact with a bottom cathode electrode of the diode device.
8. The diode device according to claim 1 , wherein:
the semiconductor substrate is an N-type semiconductor substrate and the heavily doped bottom layer is a heavily N-doped bottom layer having a charge concentration of approximately 5E12/cm 2 .
9. The diode device according to claim 1 , wherein:
the semiconductor substrate is an N-type semiconductor substrate and the additional buffer layer of the first conductivity type disposed above and more heavily doped than the buffer layer of the first conductivity having a dopant concentration ranging between 1 E15/cm 3 and 1 E16/cm 3 .