Silicon germanium and germanium multigate and nanowire structures for logic and multilevel memory applications
A method to provide a transistor or memory cell structure. The method comprises: providing a substrate including a lower Si substrate and an insulating layer on the substrate; providing a first projection extending above the insulating layer, the first projection including an Si material and a Si1-xGex material; and exposing the first projection to preferential oxidation to yield a second projection including a center region comprising Ge/Si1-yGey and a covering region comprising SiO2 and enclosing the center region.
1. A method to form a microelectronic structure comprising:
providing a substrate including a lower Si substrate and an insulating layer on the substrate;
forming a projection on the substrate projecting above the insulating layer and including a center region comprising a floating nanowire channel comprising Ge/Si1-yGEy and a covering region enclosing the center region, wherein the covering region comprises an insulation covering surrounding the nanowire channel and electrically insulating the nanowire channel and wherein both the center region and an interface between the center region and the covering region has substantially no dislocation defects.
2. The method of claim 1 , further comprising forming a nanowire transistor on the substrate comprising a high k gate dielectric, a metal gate, spacers, source and drain contacts, isolation regions and interconnects.
3. The method of claim 1 , wherein the center region comprises a plurality of center subregions comprising respective floating nanowires, and the covering region includes an insulation covering surrounding the nanowires and electrically insulating each of the nanowires.
4. The method of claim 3 , further comprising forming a multilevel memory cell comprising a control gate, spacers, source, and drain contacts and interconnects.