Cleaning solution comprising an ether acetate for preventing pattern collapse
View Patent ↗A chemical solution for use in cleaning a patterned substrate includes water, from approximate 0.01 to 99.98 percent by weight; hydrogen peroxide, from 0 to 30 percent by weight; a pH buffering agent, from approximate 0.01 to 50 percent by weight; a metal chelating agent, from approximate 0 to 10 percent by weight; and a compound for lowering a surface tension of the combination of water, hydrogen peroxide, pH buffering agent, and metal chelating agent. Examples of the compound include an organic solvent, from approximate 0 to 95 percent by weight, or a non-ionic surfactant agent, from approximate 0 to 2 percent by weight.
1. A chemical solution for use in cleaning a patterned substrate, the chemical solution comprising:
water, from approximately 0.01 to 99.98 percent by weight;
hydrogen peroxide, from 0 to 30 percent by weight;
a pH buffering agent, from approximately 0.01 to 50 percent by weight;
a metal chelating agent, from approximately 0 to 10 percent by weight;
a compound for lowering a surface tension of the combination of water, hydrogen peroxide, pH buffering agent, and metal chelating agent,
wherein the compound includes an ether acetate, and wherein the ether acetate includes ethylene glycol monobutyl ether acetate (C 4 H 9 OC 2 H 4 OCOCH 3 ) or diethylene glycol monobutyl ether acetate (C 4 H 9 OC 2 H 4 OC 2 H 4 OCOCH 3 ).
2. The chemical solution of claim 1 , wherein the compound further includes an organic solvent, which is selected from the functional group of alcohol, and alcohol ether, wherein a ratio of carbon and oxygen in the organic solvent is no more than 5 (C/O<5).
3. The chemical solution of claim 1 , wherein the compound further includes an organic solvent including an alcohol and wherein the alcohol includes at least one of a propanol, a butanol, 2-methoxyethanol (CH 3 OC 2 H 4 OH), 2-ethoxyethanol (C 2 H 5 OC 2 H 4 OH), 2-butoxyethanol (C 4 H 9 OC 2 H 4 OH), or n-hexyl glycol (CH 6 H 13 OC 2 H 4 OH).
4. The chemical solution of claim 1 , wherein the compound further includes an organic solvent, which is selected from the functional group consisting of propylene glycol monomethyl ether (CH 3 OC 3 H 6 OH), propylene glycol monoethyl ether (C 2 H 5 OC 3 H 6 OH), propylene glycol monobutyl ether (C 4 H 9 OC 3 H 6 OH), propylene glycol monohexyl ether (C 6 H 13 OC 3 H 6 OH), diethylene glycol monomethyl ether (CH 3 OC 2 H 4 OC 2 H 4 OH), diethylene glycol monoethyl ether (C 2 H 5 OC 2 H 4 OC 2 H 4 OH), diethylene glycol monobutyl ether (C 4 H 9 OC 2 H 4 OC 2 H 4 OH), dipropylene glycol monomethyl ether (CH 3 OC 3 H 6 OC 3 H 6 OH), dipropylene glycol monoethyl ether (C 2 H 5 OC 3 H 6 OC 3 H 6 OH), or dipropylene glycol monobutyl ether (C 4 H 9 OC 3 H 6 OC 3 H 6 OH).
5. The chemical solution of claim 1 , wherein the compound further includes a non-ionic surfactant selected from the functional group of alkyl ethers and alkylphenol ethers containing glycoside, polyethylene glycol, polypropylene glycol, or combinations thereof.
6. The chemical solution of claim 1 , wherein the compound further includes a non-ionic surfactant selected from the functional group consisting of octyl glucoside (C 6 H 11 O 6 (CH 2 ) 7 CH 3 ), decyl glucoside (C 6 H 11 O 6 (CH 2 ) 9 CH 3 ), dodecyl glucoside (C 6 H 11 O 6 (CH 2 ) 11 CH 3 ), pentaethylene glycol monododecyl ether (CH 3 (CH 2 ) 11 (OC 2 H 4 ) 5 OH), octaethylene glycol monododecyl ether (CH 3 (CH 2 ) 11 (OC 2 H 4 ) 8 OH), octalpropylene glycol monododecyl ether (CH 3 (CH 2 ) 11 (OC 3 H 6 ) 8 OH), polyethylene glycol p-(1,1,3,3-tetramethylbutanol (CH 14 H 22 (OC 2 H 4 ) 10 OH), polyoxyethylene sorbitan monooleate (C 24 H 43 O 5 (OC 2 H 4 ) 20 OH), polyoxyethylene octylphenyl ether (C 8 H 17 C 6 H 4 (OC 2 H 4 ) 12 OH), or polyoxyethylene nonylphenyl ether (C 9 H 19 C 6 H 4 (OC 2 H 4 ) 9 OH).
7. The chemical solution of claim 1 , wherein the pH buffering agent includes a first buffer for controlling a pH value ranging from approximately 1 to 9.
8. The chemical solution of claim 7 , wherein the pH buffering agent includes a second buffer for controlling a pH value ranging from approximately 6 to 11.
9. A chemical solution for use in cleaning a patterned substrate, the chemical solution comprising:
an organic solvent, from approximately 0 to 95 percent by weight;
a non-ionic surfactant agent, from approximately 0 to 2 percent by weight;
water, from approximately 0.01 to 99.98 percent by weight;
hydrogen peroxide, from 0 to 30 percent by weight;
a pH buffering agent, from approximately 0.01 to 50 percent by weight; and
a metal chelating agent, from approximately 0 to 10 percent by weight,
wherein the organic solvent includes an ether acetate, and wherein the ether acetate includes ethylene glycol monobutyl ether acetate (C 4 H 9 OC 2 H 4 OCOCH 3 ) or diethylene glycol monobutyl ether acetate (C 4 H 9 OC 2 H 4 OC 2 H 4 OCOCH 3 ).
10. The chemical solution of claim 9 , wherein the organic solvent further includes an alcohol and wherein the alcohol includes at least one of a propanol, a butanol, 2-methoxyethanol (CH 3 OC 2 H 4 OH), 2-ethoxyethanol (C 2 H 5 OC 2 H 4 OH), 2-butoxyethanol (C 4 H 9 OC 2 H 4 OH), or n-hexyl glycol (CH 6 H 13 OC 2 H 4 OH).
11. The chemical solution of claim 9 , wherein the organic solvent includes a further solvent selected from the functional group consisting of propylene glycol monomethyl ether (CH 3 OC 3 H 6 OH), propylene glycol monoethyl ether (C 2 H 5 OC 3 H 6 OH), propylene glycol monobutyl ether (C 4 H 9 OC 3 H 6 OH), propylene glycol monohexyl ether (C 6 H 13 OC 3 H 6 OH), diethylene glycol monomethyl ether (CH 3 OC 2 H 4 OC 2 H 4 OH), diethylene glycol monoethyl ether (C 2 H 5 OC 2 H 4 OC 2 H 4 OH), diethylene glycol monobutyl ether (C 4 H 9 OC 2 H 4 OC 2 H 4 OH), dipropylene glycol monomethyl ether (CH 3 OC 3 H 6 OC 3 H 6 OH), dipropylene glycol monoethyl ether (C 2 H 5 OC 3 H 6 OC 3 H 6 OH), or dipropylene glycol monobutyl ether (C 4 H 9 OC 3 H 6 OC 3 H 6 OH).
12. The chemical solution of claim 9 , wherein the organic solvent includes a further solvent selected from the functional group of alcohol, and alcohol ether, wherein a ratio of carbon and oxygen in the organic solvent is no more than 5 (C/O <5).
13. The chemical solution of claim 9 , wherein the non-ionic surfactant agent is selected from the functional group of alkyl ethers and alkylphenol ethers containing glycoside, polyethylene glycol, polypropylene glycol, or combinations thereof.
14. The chemical solution of claim 9 , wherein the non-ionic surfactant agent is selected from the functional group consisting of octyl glucoside (C 6 H 11 O 6 (CH 2 ) 7 CH 3 ), decyl glucoside (C 6 H 11 O 6 (CH 2 ) 9 CH 3 ), dodecyl glucoside (C 6 H 11 O 6 (CH 2 ) 11 CH 3 ), pentaethylene glycol monododecyl ether (CH 3 (CH 2 ) 11 (OC 2 H 4 ) 5 OH), octaethylene glycol monododecyl ether (CH 3 (CH 2 ) 11 (OC 2 H 4 ) 8 OH), octalpropylene glycol monododecyl ether (CH 3 (CH 2 ) 11 (OC 3 H 6 ) 8 OH), polyethylene glycol p-0,1,3,3-tetramethylbutanol (CH 14 H 22 (OC 2 H 4 ) 10 OH), polyoxyethylene sorbitan monooleate (C 24 H 43 O 5 (OC 2 H 4 ) 20 OH), polyoxyethylene octylphenyl ether (C 8 H 17 C 6 H 4 (OC 2 H 4 ) 12 OH), or polyoxyethylene nonylphenyl ether (C 9 H 19 C 6 H 4 (OC 2 H 4 ) 9 OH).
15. The chemical solution of claim 9 , wherein the pH buffering agent includes a first buffer for controlling a pH value ranging from approximately 1 to 9.
16. The chemical solution of claim 15 , wherein the pH buffering agent includes a second buffer for controlling a pH value ranging from approximately 6 to 11.