Fabrication of MEMS based cantilever switches by employing a split layer cantilever deposition scheme
Embodiments discussed herein generally disclose novel alternative methods that can be employed to overcome the gradient stress formed in refractory materials to be used for thin film MEMS cantilever switches. The use of a ‘split layer’ cantilever fabrication method, as described herein enables thin film MEMS cantilever switches to be fabricated resulting in low operating voltage devices while maintaining the mechanical rigidity of the landing portion of the final fabricated cantilever switch.
1. A micro-electromechanical device, comprising:
a first electrical contact disposed over a substrate;
a contact electrode disposed over the substrate and laterally spaced from the first electrical contact;
a conductive beam structure having an anchor portion in contact with the first electrical contact, a leg portion, and a plate portion, the plate portion vertically spaced from the contact electrode, the leg portion movable to move the plate portion into contact with the contact electrode;
a first reinforcement element coupled to the anchor portion such that the anchor portion and first reinforcement element are collectively thicker than the leg portion; and
a second reinforcement element coupled to the plate portion and laterally spaced from the first reinforcement element such that a gap is present between the first reinforcement element and the second reinforcement element over the leg portion, and wherein the second reinforcement element and the plate portion collectively are thicker than the leg portion.
2. The device of claim 1 , wherein the conductive beam comprises titanium nitride.
3. The device of claim 2 , wherein the first reinforcement element and the second reinforcement member each comprise titanium nitride.
4. The device of claim 2 , wherein the first reinforcement element comprises an insulating material.
5. The device of claim 1 , wherein the second reinforcement element is vertically spaced from the plate portion at one or more first locations and in contact with the plate portion in one or more second locations.
6. The device of claim 1 , wherein the first reinforcement element has a length less than a length of the second reinforcement element.
7. The device of claim 6 , wherein the first reinforcement element is spaced from the second reinforcement element by a distance less than a length of the first reinforcement element.
8. A micro-electromechanical device, comprising:
an anchor portion having a first rigidity;
a leg portion coupled to the anchor portion and having a second rigidity less than the first rigidity;
a plate portion coupled to the leg portion and having a third rigidity greater than the second rigidity; and
one or more layers that span across the plate portion, the leg portion, and the anchor portion to couple the plate portion, the leg portion, and the anchor portion together, the one or more layers comprising a conductive layer.
9. The device of claim 8 , wherein the one or more layers comprise titanium nitride.
10. The device of claim 8 , wherein the one or more layers additionally comprise an insulating layer.
11. The device of claim 8 , wherein the leg portion consists of the one or more layers and has a thickness that is less than the thickness of the plate portion.
12. A micro-electromechanical device, comprising:
a first electrical contact disposed over a substrate;
an electrode disposed over the substrate and laterally spaced from the first electrical contact;
a conductive beam structure having an anchor portion in contact with the first electrical contact, a leg portion, and a plate portion, the plate portion vertically spaced from the electrode, and the leg portion movable to move the plate portion into contact with the electrode; and
a reinforcement element coupled to the plate portion such that portions of the reinforcement element are vertically spaced from the conductive beam structure.
13. The device of claim 12 , wherein the conductive beam structure comprises titanium nitride.
14. The device of claim 13 , wherein the reinforcement element comprises titanium nitride.
15. The device of claim 13 , wherein the reinforcement element comprises an insulating material.
16. The device of claim 12 , wherein the plate portion is a waffle shaped structure.
17. The device of claim 12 , wherein the leg portion has a greater flexibility as compared to the plate portion.
18. The device of claim 17 , wherein the conductive beam structure comprises titanium nitride.
19. The device of claim 18 , wherein the reinforcement element comprises titanium nitride.