IP Library Granted Patent US 8,960,000
Granted Patent B2
US 8,960,000 · App. 13/545,075 · Granted Feb 24, 2015

Sensor device, and electronic apparatus

Inventors: Masayasu Sakuma (Kamiina, JP); Yoshihiro Kobayashi (Komagane, JP); Shojiro Kitamura (Suwa, JP); Taketo Chino (Hokuto, JP)
Assignee: Seiko Epson Corporation
G01C21/16G01C19/5769G01D11/245G01D11/30
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Quick Facts
Patent No.
US 8,960,000
App. No.
13/545,075
Granted
Feb 24, 2015
Kind
B2
Abstract

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Claims (22)

1. A sensor device comprising:

a housing member having first through fourth walls and an inside space, the fourth wall facing the first wall and being continuously connected to the second and third walls;

first through third boards respectively provided at an interior of the first through third walls of the housing member, the first through third boards being perpendicular to each other, the first through third boards respectively having first through third fixation surfaces;

a through-hole provided in the fourth wall of the housing member; and

first through third angular velocity sensors respectively provided at the first through third fixation surfaces of the first through third boards, wherein

the first through third angular velocity sensors respectively have first through third detection axes intersecting with each other, and

a connector, which outputs signals from the first through third angular velocity sensors, is exposed through the through-hole provided at the fourth wall of the housing member.

2. The sensor device according to claim 1 , wherein

the third wall of the housing member has a first recessed section opened toward the inside space, and the first recessed section is located between the third wall and the third board.

3. The sensor device according to claim 2 , wherein

the third angular velocity sensor is provided at the third fixation surface of the third board, and the third angular velocity sensor is housed in the first recessed section.

4. The sensor device according to claim 2 , further comprising

a fifth wall of the housing member, the fifth wall facing the third wall and being continuously connected to the first, second and fourth walls; and

a fourth board provided at the fifth wall, wherein

the fifth wall has a second recessed section opened toward the inside space, and the second recessed section is located between the fifth wall and the fourth board.

5. The sensor device according to claim 4 , wherein

the third angular velocity sensor is provided at the third fixation surface of the third board, and the third angular velocity sensor is housed in the first recessed section.

6. The sensor device according to claim 5 , wherein

a direction sensor is provided at a fourth fixation surface of the fourth board, and the direction sensor is housed in the second recessed section.

7. The sensor device according to claim 1 , wherein

the first through third boards are bendable.

8. An electronic apparatus comprising: the sensor device according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2012
From: SAKUMA, MASAYASU; KOBAYASHI, YOSHIHIRO; KITAMURA, SHOJIRO; CHINO, TAKETO
To: SEIKO EPSON CORPORATION
Reel/Frame 028519/0853 →
Priority Claims (1)
JP 2011-154502 · Jul 13, 2011 · national
Continuity (1)
Related Publication 20130014578A1 · Jan 17, 2013