IP Library Granted Patent US 8,963,087
Granted Patent B2
US 8,963,087 · App. 13/264,908 · Granted Feb 24, 2015

Infrared light sensor having a high signal voltage and a high signal/noise ratio

Inventors: Carsten Giebeler (Edinburgh, GB); Jeffrey Wright (East Lothian, GB); Tim Chamberlain (Edinburgh, GB)
Assignee: Pyreos Ltd.
G01J5/34G01J5/08G01J5/0846
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Quick Facts
Patent No.
US 8,963,087
App. No.
13/264,908
Granted
Feb 24, 2015
Kind
B2
Abstract

An infrared light sensor for an infrared light detector ( 1 ), including a substrate membrane section ( 2 ) and at least two sensor chips ( 7 to 10 ), which are fastened next to each other on the substrate membrane section ( 2 ) and each comprise a layer element ( 11 ) which is produced from pyroelectrically sensitive material and is electrically contacted by a base electrode ( 12 ) and a head electrode ( 13 ) and is arranged in such that there is a voltage difference in each case between the head electrode ( 13 ) and the base electrode ( 12 ) of each layer element ( 11 ) when the layer elements ( 11 ) are irradiated with infrared light; and a coupling line ( 14 to 16 ) in each case for two adjacently arranged sensor chips ( 7 to 10 ), the coupling line coupling the head electrode ( 13 ) of the one sensor chip ( 7 to 9 ) and the base electrode ( 12 ) of the other sensor chip ( 8 to 10 ) to each other in an electrically conductive manner so that the layer elements ( 11 ) of the sensor chips ( 7 to 10 ) are connected in a series circuit, which has one of the base electrodes ( 17 ) at one end thereof and one of the head electrodes ( 18 ) at the other end thereof, at which a total voltage difference of the series circuit can be tapped as the sum of the individual voltage differences of the layer elements ( 11 ).

Claims (17)

1. An infrared light detector comprising:

a substrate membrane;

one or more infrared light sensors, each of the sensors comprising a respective segment of the substrate membrane and at least two sensor chips; and

one or more electronic readout components, each of the components respectively associated with a given one of the sensors;

wherein each of the sensor chips comprises:

(a) a layer element consisting essentially of pyroelectrically sensitive material,

(b) a base electrode and a head electrode each electrically contacting the layer element and configured such that exposure of at least a part of the layer element to infrared light produces an individual voltage difference between the head electrode and the base electrode, and

(c) a coupling line,

wherein the at least two sensor chips are attached physically adjacent one another on the substrate membrane segment and are electrically interconnected in a series circuit by the coupling line such that the head electrode of a first of the sensor chips and the base electrode of a last of the sensor chips are electrically interconnected,

wherein the series circuit is electrically connected to a respective one of the electronic readout components with one of the base electrodes and with one of the head electrodes, to provide a total voltage difference of the series circuit as a sum of the individual voltage differences of the respective layer elements of the sensor chips for a respective one of the infrared light sensors, and

wherein a total capacitance value of the series circuit is at least three times an input capacitance value of a respective one of the electronic readout components.

2. The infrared light detector according to claim 1 , wherein the pyroelectrically sensitive material is lead-zirconate-titanate.

3. The infrared light detector according to claim 1 , wherein the layer element is a thin film.

4. The infrared light detector according to claim 1 , wherein the sensor chips are thermally conductively connected via the substrate membrane segment and the coupling line.

5. The infrared light detector according to claim 1 , wherein the infrared light sensors are arranged in a grid arrangement on the substrate membrane.

6. The infrared light detector according to claim 1 , wherein the infrared light sensors are arranged so as to be thermally insulated from one another.

7. The infrared light detector according to claim 1 , configured to be housed in at least one of a thermal imaging camera, a presence sensor, a motion sensor, a gas detector, a spectroscope and a terahertz detector.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2022
From: PYREOS LIMITED
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 059733/0972 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2014
From: GIEBELER, CARSTEN; WRIGHT, JEFFREY; CHAMBERLAIN, TIM
To: PYREOS LTD.
Reel/Frame 034163/0978 →
Priority Claims (1)
DE 10 2009 017 845 · Apr 17, 2009 · national
Continuity (1)
Related Publication 20120132807A1 · May 31, 2012