Packaged microphone with frame having die mounting concavity
A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.
1. A packaged microphone comprising:
a lid structure having an inner surface with a concavity;
a microphone die secured within the concavity;
a substrate coupled with the lid structure and being electrically connected with the microphone die, the substrate and lid structure forming a package having an interior volume containing the microphone die within the concavity;
an aperture through the package; and
a seal proximate to the microphone die, the seal acoustically sealing the microphone and the aperture to form a front volume and a back volume within the interior volume, the aperture being in acoustic communication with the front volume.
2. The packaged microphone as defined by claim 1 wherein the lid structure comprises a cover and a frame, the cover and frame being secured together to form the back volume.
3. The packaged microphone as defined by claim 1 wherein the lid structure comprises injection molded plastic.
4. The packaged microphone as defined by claim 1 wherein the lid structure comprises a printed circuit board secured to a plastic frame.
5. The packaged microphone as defined by claim 1 wherein the microphone die comprises a variable capacitor formed from a diaphragm and a backplate, the microphone die being mounted with the diaphragm a first distance from the aperture, the die being mounted with the backplate being mounted a second distance from the aperture, the first distance being less than the second distance.
6. The packaged microphone as defined by claim 1 wherein the seal is between the microphone and the substrate.
7. The packaged microphone as defined by claim 1 wherein the seal is between the substrate and the lid structure.
8. The packaged microphone as defined by claim 1 further comprising a bump or ball electrically connecting the microphone die to the substrate.
9. The packaged microphone as defined by claim 1 further comprising a second die in the concavity.
10. The packages microphone as defined by claim 1 wherein the lid structure comprises a printed circuit board secured to a plastic frame.