Temporary fixing composition
In the past, it was difficult to fix an adherend sufficiently during polishing processing and to peel off the adherend conveniently. Provided is a non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N.
1. A non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N per adhesion area of 15 mm×50 mm, comprising:
(A) a thermoplastic resin consisting of α-olefin monomer units having 16-35 carbon atoms; and
(B) a hydrocarbon component selected from the group consisting of thermoplastic resins other than the component (A), thermoplastic elastomers and rubber elastomers, wherein said hydrocarbon component is solid at 25° C.; and/or
(C) a hydrocarbon compound that is liquid at 25° C. and has a viscosity of 1 to 1,000 mPa·s at 25° C.;
wherein component (B) is present in 0 to 30 parts by mass with respect to 100 parts by mass of component (A), and/or component (C) is present in 0 to 80 parts by mass with respect to 100 parts by mass of component (A).
2. The temporary fixing composition for plane polishing according to claim 1 , which has a melt viscosity of 1 to 500 mPa·s at 100° C.
3. The temporary fixing composition for plane polishing according to claim 1 , which composition is a non-sticky solid at 25° C.
4. A non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N per adhesion area of 15 mm×50 mm, comprising:
(A) a thermoplastic resin consisting of poly-α-C 16 -C 35 -olefin; and
(B) a hydrocarbon component selected from the group consisting of thermoplastic resins other than the component (A), thermoplastic elastomers and rubber elastomers, wherein said hydrocarbon component is solid at 25° C.; and/or
(C) a hydrocarbon compound that is liquid at 25° C. and has a viscosity of 1 to 1,000 mPa·s at 25° C.;
wherein component (B) is present in 0.1 to 30 parts by mass with respect to 100 parts by mass of component (A), and/or component (C) is present in 1 to 80 parts by mass with respect to 100 parts by mass of component (A).
5. The temporary fixing composition for plane polishing according to claim 4 , which has a melt viscosity of 1 to 500 mPa·s at 100° C.
6. The temporary fixing composition for plane polishing according to claim 4 , which composition is a non-sticky solid at 25° C.