IP Library Granted Patent US 8,981,664
Granted Patent B2
US 8,981,664 · App. 12/339,801 · Granted Mar 17, 2015

Current limiting device for plasma power supply

Inventors: Andrzej Klimczak (Warsaw, PL); Rafal Bugyi (Warsaw, PL); Pawel Ozimek (Warsaw, PL)
Assignee: TRUMPF Huettinger Sp. zo. o.
H02H9/021H01J37/3444H01J37/3467
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Quick Facts
Patent No.
US 8,981,664
App. No.
12/339,801
Granted
Mar 17, 2015
Kind
B2
Abstract

The current (I out ) flowing between a plasma chamber and a power supply is limited by limiting the current change di/dt if the current exceeds a predetermined current. A current change limiting device is provided in the current path between the power supply and the plasma chamber and is configured to determine if the current exceeds the predetermined current and limits the current change.

Claims (38)

1. A current change limiting arrangement provided in a current path between a power supply and a plasma chamber, the arrangement comprising:

a direct-reaction circuit configured to limit the current change of a current (I out ) flowing between the plasma chamber and the power supply when the current (I out ) exceeds a predetermined current, wherein the direct-reaction circuit is configured to not limit the current change of the current when the current (I out ) does not exceed the predetermined current and wherein the predetermined current is selected to be higher than a highest expected normal operation current based on a current output of the power supply; and

an indirect-reaction circuit configured to interrupt the current flow between the power supply and the plasma chamber.

2. The current change limiting arrangement of claim 1 , further comprising a current change limiting device provided in the current path between the power supply and the plasma chamber to limit the current change of the current (I out ) flowing between the plasma chamber and the power supply, the current change limiting device comprising an auxiliary power supply, a non-linear device, and an inductor that is pre-charged by application of a supplementary DC current from the auxiliary power supply to the inductor.

3. The current change limiting arrangement of claim 2 , wherein the indirect reaction circuit includes a semiconductor switch reactive to a measurement device.

4. A vacuum treatment apparatus comprising:

a power supply,

a plasma chamber, and

a current change limiting device provided in a current path between the power supply and the plasma chamber, the current change limiting device comprising a non-linear device and an inductor that is configured to be pre-charged by application of a supplemental current to the inductor;

wherein the current change limiting device is configured to maintain a predetermined current level in the inductor while a current (Iout) flowing between the plasma chamber and the power supply is less than the predetermined current level, and to limit a current change of the current (Iout) by adjusting the supplemental current in response to the current (Iout) exceeding the predetermined current level, the predetermined current level, and wherein the predetermined current is selected to be higher than a highest expected normal operation current that is based on a current output of the power supply.

5. A method of limiting a current change in a current (I out ) flowing between a plasma chamber and a power supply, the method comprising:

selecting a predetermined current level to be higher than a highest expected normal operation current;

limiting the current change if the current (Iout) exceeds the predetermined current level, by function of a current change limiting device comprising an inductor provided in a current path between the power supply and the plasma chamber; and

maintaining the predetermined current level in the inductor, by supplying a supplemental current (Iadd) to the inductor in response to the current (Iout) being less than the predetermined current level;

wherein the supplemental current is adjusted in response the current (Iout) exceeding the predetermined current level.

6. The method of claim 5 , further comprising operating the power supply as a voltage source.

7. The method of claim 5 , further comprising measuring the current flowing between the plasma chamber and the power supply.

8. The method of claim 5 , further comprising measuring the current flowing through the inductor.

9. The method of claim 5 , further comprising inputting a current limiting set-point to the current change limiting device.

10. The method of claim 5 , further comprising controlling the supplemental current based on the current flowing between the plasma chamber and the power supply.

11. The method of claim 5 , further comprising measuring the voltage (U CL ) across the current change limiting device.

12. The method of claim 5 , further comprising detecting an arc if a voltage (U CL ) across the current change limiting device exceeds a predetermined value.

13. The method of claim 5 , further comprising interrupting the current path between the power supply and the plasma chamber subsequent to limiting the current change.

14. A plasma chamber power supply current change limiting device comprising:

a non-linear device; and

an inductor coupled to the non-linear device and configured to be provided in a current path between a power supply and a plasma chamber;

wherein the current change limiting device is operable to maintain a predetermined current level in the inductor while a current (Iout) flowing between the plasma chamber and the power supply is less than the predetermined current level, and to limit a current change of the current (Iout) in response to the current (Iout) exceeding the predetermined current level, by adjusting a supplemental current (Iadd) provided to the inductor, wherein the predetermined current is selected to be higher than a highest normal operation current.

15. The plasma chamber power supply current change limiting device of claim 14 , wherein the power supply is a voltage source.

16. The plasma chamber power supply current change limiting device of claim 14 , further comprising a current measuring device configured to be positioned between the plasma chamber and the power supply to measure the current flowing between the plasma chamber and the power supply.

17. The plasma chamber power supply current change limiting device of claim 14 , further comprising an input for inputting a current limiting set-point.

18. The plasma chamber power supply current change limiting device of claim 14 , further comprising a voltage source or a current source.

19. The plasma chamber power supply current change limiting device of claim 14 , wherein the non-linear device includes a diode.

20. The plasma chamber power supply current change limiting device of claim 14 , further comprising a diode bridge circuit and an auxiliary power supply connected to the diode bridge circuit, wherein the diode bridge circuit provides the supplemental current to the inductor.

21. The vacuum treatment apparatus of claim 4 , the current change limiting device comprising a current source configured to supply the supplemental current to the inductor.

22. The vacuum treatment apparatus of claim 21 , the current source comprising an auxiliary power supply coupled to a current measurement device configured to measure the current in the inductor, wherein the auxiliary power supply is configured to use the measured current to maintain the predetermined current level in the current.

23. The vacuum treatment apparatus of claim 22 , wherein the auxiliary power supply is coupled to an output transformer, and wherein output transformer is coupled to the inductor by a bridge circuit of one or more diodes.

24. The vacuum treatment apparatus of claim 22 , wherein the auxiliary power supply is configured to supply the supplemental current to the inductor when the current (Iout) flowing between the plasma chamber and the power supply is less than the predetermined current level, and wherein the auxiliary power supply is configured to cease supplying the supplemental current to the inductor in response to the current (Iout) exceeding the predetermined current level.

25. The vacuum treatment apparatus of claim 24 , wherein the auxiliary power supply is configured to supply the supplemental current to the inductor when the current (Iout) flowing between the plasma chamber and the power supply is less than the predetermined current level by setting the supplemental current to the difference between the predetermined current level and the measure current from the current measurement device.

Assignments (2)
CHANGE OF NAME Recorded Mar 26, 2014
From: HUETTINGER ELECTRONIC SP. Z O.O.
To: TRUMPF HUETTINGER SP. Z O. O.
Reel/Frame 032535/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2009
From: KLIMCZAK, ANDRZEJ; BUGYI, RAFAL; OZIMEK, PAWEL
To: HUETTINGER ELECTRONIC SP. Z.O.O. (TPLE)
Reel/Frame 022316/0715 →
Priority Claims (1)
EP 07025085 · Dec 24, 2007 · regional
Continuity (1)
Related Publication 20090160417A1 · Jun 25, 2009