Multi layer ceramic capacitor

1. A multilayer ceramic capacitor, comprising:

a multilayer ceramic plastic body formed so that a plurality of internal electrode layers intersects; and

a plurality of external electrodes, each formed to cover one side or another side of the multilayer ceramic plastic body and connected to the plurality of internal electrode layers,

wherein each of the plurality of external electrodes includes a plurality of conductive layers that is sequentially formed to cover one side or another side of the multilayer ceramic plastic body, and one of the plurality of conductive layers is formed of conductive resin hardened through an irradiation cross-linking method using gamma ray, and

wherein a material of the conductive resin includes a conductive agent of 70 wt % to 90 wt %, resin of 9 wt % to 27 wt %, an irradiation cross-linking agent of 0.3 wt % to 1 wt %, and a metal chain agent of 1 wt % to 3 wt %.

2. The multilayer ceramic capacitor of claim 1 , wherein the plurality of conductive layers comprises:

a first conductive layer formed to cover a circumferential surface and a cross section of the one side or the other side of the multilayer ceramic plastic body and connected to the plurality of internal electrode layers:

a second conductive layer disposed on the first conductive layer to cover the first conductive layer;

a third conductive layer disposed on the second conductive layer to cover the second conductive layer; and

a fourth conductive layer disposed on the third conductive layer to cover the third conductive layer, and

the second conductive layer is formed of conductive resin hardened through the irradiation cross-linking method using gamma ray.

3. The multilayer ceramic capacitor of claim 2 , wherein the first conductive layer is formed on the cross section of the one side or the other side of the multilayer ceramic plastic body, the second conductive layer is formed on the edge of the first conductive layer and the circumferential surface of the one side or the other side of the multilayer ceramic plastic body, and the third conductive layer is formed to cover the first conductive layer and the second conductive layer.

4. The multilayer ceramic capacitor of claim 2 , wherein between the second conductive layer and the third conductive layer, the second conductive layer is formed along a circumferential surface of the first conductive layer, and the third conductive layer is formed to cover the first conductive layer and the second conductive layer.

5. The multilayer ceramic capacitor of claim 2 , wherein one of Ag, Ag—Pt, Cu, Ni, and Sn is used for a material of each of the first conductive layer, the third conductive layer, and the fourth conductive layer.

6. The multilayer ceramic capacitor of claim 1 , wherein the irradiation cross-linking method uses gamma ray that is irradiated at 10 Mrad to 20 Mrad.

7. The multilayer ceramic capacitor of claim 1 , wherein one of or a mixture of at least one of Cu, Ni, Sn, Ag, and Al is used for the conductive agent.

8. The multilayer ceramic capacitor of claim 1 , wherein one of or a mixture of at least two of epoxy, polyimide, polytetrafluoroethylene (PTFE), and phenol is used for the resin.

9. The multilayer ceramic capacitor of claim 1 , wherein one of polyethylene terephthalate (PET) and poly sulfone (PSF) is used for the irradiation cross-linking agent.

10. The multilayer ceramic capacitor of claim 1 , wherein one of carbon nano tube and carbon black is used for the metal chain agent.