IP Library › Granted Patent US 9,000,438
Granted Patent B2
US 9,000,438 · App. 13/030,199 · Granted Apr 7, 2015

Semiconductor device and manufacturing method thereof

Inventors: Masami Jintyou (Tochigi, JP); Yamato Aihara (Tochigi, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
G02F1/133555G02F1/133524G02F1/1368H01L27/1225
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Quick Facts
Patent No.
US 9,000,438
App. No.
13/030,199
Granted
Apr 7, 2015
Kind
B2
Abstract

It is an object to provide a display device of which image display can be favorably recognized. Another object is to provide a manufacturing method of the display device with high productivity. Over a substrate, a pixel electrode that reflects incident light through a liquid crystal layer, a light-transmitting pixel electrode, and a structure whose side surface is covered with a reflective layer and which is positioned to overlap with the light-transmitting pixel electrode are provided. The structure is formed over a light-transmitting etching-stop layer, and the etching-stop layer remains below the structure as a light-transmitting layer.

Claims (41)

1. A semiconductor device comprising:

a structure including a side surface, a bottom surface and a top surface;

a first pixel electrode;

a second pixel electrode over the structure;

a first transistor electrically connected to the first pixel electrode;

a second transistor electrically connected to the second pixel electrode;

a liquid crystal over the structure, the first pixel electrode, the second pixel electrode, the first transistor, and the second transistor; and

a reflective layer covering the side surface of the structure,

wherein an area of the bottom surface of the structure is larger than an area of the top surface of the structure.

2. The semiconductor device according to claim 1 , wherein each of the first transistor and the second transistor include an oxide semiconductor.

3. The semiconductor device according to claim 1 , wherein the reflective layer includes aluminum or silver.

4. The semiconductor device according to claim 1 , wherein the first pixel electrode is configured to reflect an incident light.

5. The semiconductor device according to claim 1 , wherein the bottom surface of the structure is in contact with an oxide semiconductor.

6. The semiconductor device according to claim 5 , wherein a refractive index of the structure is higher than a refractive index of the oxide semiconductor.

7. The semiconductor device according to claim 1 , wherein the second pixel electrode comprises a light-transmitting electrode.

8. A semiconductor device comprising a plurality of pixels, each of the plurality of pixels comprising:

a structure including a side surface, a bottom surface and a top surface;

a first pixel electrode;

a second pixel electrode over the structure;

a first transistor electrically connected to the first pixel electrode;

a second transistor electrically connected to the second pixel electrode; and

a reflective layer covering the side surface of the structure,

wherein an area of the bottom surface of the structure is larger than an area of the top surface of the structure.

9. The semiconductor device according to claim 8 , wherein each of the first transistor and the second transistor include an oxide semiconductor.

10. The semiconductor device according to claim 8 , wherein the reflective layer includes aluminum or silver.

11. The semiconductor device according to claim 8 , wherein the first pixel electrode is configured to reflect an incident light.

12. The semiconductor device according to claim 8 , wherein the second pixel electrode comprises a light-transmitting electrode.

13. The semiconductor device according to claim 8 , wherein the bottom surface of the structure is in contact with an oxide semiconductor.

14. The semiconductor device according to claim 13 , wherein a refractive index of the structure is higher than a refractive index of the oxide semiconductor.

15. A semiconductor device comprising:

a structure including a side surface, a bottom surface and a top surface;

a transparent pixel electrode over the structure;

a reflective pixel electrode;

a first transistor electrically connected to the transparent pixel electrode;

a second transistor electrically connected to the reflective pixel electrode; and

a reflective layer covering the side surface of the structure,

wherein an area of the bottom surface of the structure is larger than an area of the top surface of the structure.

16. The semiconductor device according to claim 15 , wherein each of the first transistor and the second transistor include an oxide semiconductor.

17. The semiconductor device according to claim 15 , wherein the reflective layer includes aluminum or silver.

18. The semiconductor device according to claim 15 , wherein the bottom surface of the structure is in contact with an oxide semiconductor.

19. The semiconductor device according to claim 18 , wherein a refractive index of the structure is higher than a refractive index of the oxide semiconductor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2011
From: JINTYOU, MASAMI; AIHARA, YAMATO
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 026257/0405 →
Priority Claims (1)
JP 2010-043185 · Feb 26, 2010 · national
Continuity (1)
Related Publication 20110210332A1 · Sep 1, 2011