IP Library Granted Patent US 9,000,867
Granted Patent B2
US 9,000,867 · App. 13/590,890 · Granted Apr 7, 2015

Acoustic wave device and module

Inventor: Yohei Shimizu (Kanagawa, JP)
Assignee: Taiyo Yuden Co., Ltd.
H03H3/10H03H9/02574H03H9/02834
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Quick Facts
Patent No.
US 9,000,867
App. No.
13/590,890
Granted
Apr 7, 2015
Kind
B2
Abstract

An acoustic wave device includes: a support substrate composed of lithium tantalate in multi-polarization condition; an element substrate that is provided on an upper face of the support substrate and is composed of lithium tantalate, a lower face of the element substrate being jointed to the upper face of the support substrate; and a comb-like electrode that is provided on an upper face of the element substrate and excites an acoustic wave.

Claims (27)

1. An acoustic wave device, comprising:

a support substrate composed of lithium tantalate in multi-polarization condition;

an element substrate that is provided on an upper face of the support substrate and is composed of lithium tantalate, a lower face of the element substrate being joined to the upper face of the support substrate; and

a comb-like electrode that is provided on an upper face of the element substrate and excites an acoustic wave,

wherein domains that voluntarily polarizes are arrayed in the support substrate in random order.

2. The acoustic wave device as claimed in claim 1 further comprising an amorphous layer between the upper face of the support substrate and the lower face of the element substrate.

3. The acoustic wave device as claimed in claim 1 , wherein the lower face of the element substrate is joined to the upper face of the support substrate at ordinary temperature.

4. The acoustic wave device as claimed in claim 1 , wherein a normal direction of the upper face of the element substrate is a direction rotated from a Y-axis to a Z-axis by 36 degrees to 48 degrees around an X-axis.

5. The acoustic wave device as claimed in claim 1 , wherein the element substrate is thinner than the support substrate.

6. The acoustic wave device as claimed in claim 1 , wherein the comb-like electrode excites the acoustic wave at a surface of the element substrate and does not excite the acoustic wave at the support substrate.

7. An acoustic wave device, comprising:

a support substrate composed of lithium tantalate in multi-polarization condition;

an element substrate that is provided on an upper face of the support substrate and is composed of lithium tantalate, a lower face of the element substrate being joined to the upper face of the support substrate; and

a comb-like electrode that is provided on an upper face of the element substrate and excites an acoustic wave,

wherein a linear thermal expansion coefficient of the support substrate in parallel with a propagation direction of the acoustic wave is smaller than a linear thermal expansion coefficient of the support substrate in an X-axis.

8. An acoustic wave device, comprising:

a support substrate composed of lithium tantalate in multi-polarization condition;

an element substrate that is provided on an upper face of the support substrate and is composed of lithium tantalate, a lower face of the element substrate being joined to the upper face of the support substrate; and

a comb-like electrode that is provided on an upper face of the element substrate and excites an acoustic wave,

wherein a sidewall of the acoustic wave device separated into a chip has no difference in level.

9. A module, comprising

an acoustic wave device having a support substrate, an element substrate and a comb-like electrode,

the support substrate being composed of lithium tantalate in multi-polarization condition,

the element substrate being provided on an upper face of the support substrate and being composed of lithium tantalate,

a lower face of the element substrate being joined to the upper face of the support substrate,

the comb-like electrode being provided on an upper face of the element substrate and exciting an acoustic wave,

wherein domains that voluntarily polarizes are arrayed in the support substrate in random order.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2012
From: SHIMIZU, YOHEI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 028824/0361 →
Priority Claims (1)
JP 2011-180805 · Aug 22, 2011 · national
Continuity (1)
Related Publication 20130049889A1 · Feb 28, 2013