Method for manufacturing package structure with electronic component
A fabrication method of manufacturing a package a plurality of electronic components in an encapsulation body, firstly, mounting the plurality of electronic components and one ends of a plurality of metal resilient units on a substrate. After that, the plurality of electronic components and the plurality of metal resilient units are encapsulated on the substrate to form an encapsulation body with another ends of the plurality of metal resilient units exposed on an exterior surface of the encapsulation body. Then etching remaining epoxy resin on the other ends of the plurality of metal resilient units.
1. A fabrication method to package a plurality of electronic components in an encapsulation body, the fabrication method comprising:
mounting the plurality of electronic components with first ends of a plurality of metal resilient units on a substrate and second ends of the plurality of metal resilient units connected together to collectively form a metal shield to protect the electronic components from electro magnetic interference (EMI); and
etching remaining epoxy resin on the second ends of the plurality of metal resilient units, after mounting the plurality of electronic components with the first ends of a plurality of metal resilient units on a substrate and the second ends of the plurality of metal resilient units connected together to collectively form a metal shield to protect the electronic components from EMI, wherein the encapsulation body is made of epoxy; and
encapsulating the plurality of electronic components and the plurality of metal resilient units on the substrate to form an encapsulation body with second ends of the plurality of metal resilient units exposed on an exterior surface of the encapsulation body.
2. The fabrication method as claimed in claim 1 , wherein each of the plurality of resilient units comprises a metal resilient element, a first metal sheet and a second metal sheet respectively located at two ends of the metal resilient element, wherein the first metal sheet is electrically connected to the substrate, and the second metal sheet is exposed out of the exterior surface of the encapsulation body.
3. The fabrication method as claimed in claim 2 , wherein the first metal sheet and the second sheet are both in a shape of frustum of a cone.
4. The fabrication method as claimed in claim 2 , wherein the resilient element is a spring.
5. The fabrication method as claimed in claim 2 , wherein the second metal sheets of the plurality of resilient units are connected together to collectively form a metal shield to protect the electronic components from Electro Magnetic Interference (EMI).
6. The fabrication method as claimed in claim 5 , wherein the electronic components are adhered to the metal shield by thermal grease.
7. The fabrication method as claimed in claim 1 , wherein an upper surface of each second end is coplanar with an upper surface of the encapsulation body.