Semiconductor device with air gap and method of fabricating the same
A method of fabricating a semiconductor device and a semiconductor device formed by the method. The method includes form a stack conductive structure by stacking a first conductive pattern and an insulation pattern over a substrate; forming a sacrificial pattern over sidewalls of the stack conductive structure; forming a second conductive pattern having a recessed surface lower than a top surface of the stack conductive structure; forming a sacrificial spacer to expose sidewalls of the insulation pattern by removing an upper portion of the sacrificial pattern; reducing a width of the exposed portion of the insulation patters; forming a capping spacer to cap the sidewalls of the insulation pattern having the reduced width over the sacrificial spacer; and forming an air gap between the first conductive pattern and the second conductive pattern by converting the sacrificial spacer to volatile byproducts.
1. A method for fabricating a semiconductor device, the method comprising:
form a stack conductive structure by stacking a first conductive pattern and an insulation pattern over a substrate;
forming a sacrificial pattern over sidewalls of the stack conductive structure;
forming a second conductive pattern having a recessed surface lower than a top surface of the stack conductive structure;
forming a sacrificial spacer to expose sidewalls of the insulation pattern by removing an upper portion of the sacrificial pattern;
reducing a width of the exposed portion of the insulation pattern;
forming a capping spacer to cap the sidewalls of the insulation pattern having the reduced width over the sacrificial spacer; and
forming an air gap between the first conductive pattern and the second conductive pattern by converting the sacrificial spacer to volatile byproducts.
2. The method of claim 1 , wherein the converting the sacrificial spacer to a diffusible state is performed by decomposing or phase changing the sacrificial spacer.
3. The method of claim 1 , wherein the converting the sacrificial spacer to a diffusible state is performed by performing an oxidation plasma treatment.
4. The method of claim 1 , wherein the converting the sacrificial spacer to a diffusible state is performed by converting the sacrificial spacer to a vapor or gas by an oxidation reaction process.
5. The method of claim 1 , wherein the sacrificial spacer includes a carbon-containing material.
6. The method of claim 1 , wherein the capping spacer includes an insulation material having a density that is sufficiently low as to allow the converted sacrificial spacer to diffuse through the capping spacer.
7. The method of claim 1 , wherein the capping spacer includes silicon oxide.
8. The method of claim 1 , wherein after the forming of the stack conductive structure, further comprises:
forming a passivation spacer over sidewalls of the conductive structure, wherein the passivation spacer is formed of silicon nitride.
9. The method of claim 8 , wherein the passivation spacer includes an insulation material having a density that is sufficiently high as to prevent the converted sacrificial spacer from diffusing through the passivation spacer.
10. The method of claim wherein, after the forming an air gap, the method further comprises:
forming a ohmic contact layer over the second conductive pattern; and
forming a third conductive pattern over the ohmic contact layer.