Heat sink clip and method for forming the same
A heat sink clip is provided for clipping a memory module. The heat sink clip is made from a flexible heat-conductive metal plate formed by bending, and includes a top plate and two side plates facing opposite. Each side plate has a top portion, an inwardly inclined portion and a lead. The top portions of the two side plates extend from two opposite side edges of the top plate, respectively, and incline inwardly. The inwardly inclined portions of the two side plates extend from bottoms of the two top portions, respectively, and continue to incline inwardly. The leads of the two side plates extend from bottoms of the two inwardly inclined portions, respectively, and incline outwardly.
1. A heat sink clip for clipping a memory module that has a top part and two side parts, and spreading heat away from a chip of the memory module, wherein the heat sink clip is made from a flexible heat-conductive metal plate formed by bending, and comprises:
a top plate having a top surface, a planar bottom surface and two opposite side edges, wherein a straight indent is at the top surface of the top plate and is parallel to the two opposite side edges of the top plate; and
two side plates facing opposite from each other and each having a top portion, an inwardly inclined portion and a lead, wherein the top portions of the two side plates directly extend from the two opposite side edges of the top plate, respectively, and incline inwardly, wherein a distance between joints of the top portions of the two side plates and the two opposite side edges of the top plate is equal to a thickness of the memory module, wherein the inwardly inclined portions of the two side plates directly extend from bottoms of the two top portions, respectively, and continue to further incline inwardly such that bends are at joints of the two inwardly inclined portions and the two top portions, respectively, wherein the leads of the two side plates directly extend from bottoms of the two inwardly inclined portions, respectively, and incline outwardly;
wherein the planar bottom surface of the top plate is for facing the top part of the memory module, and the two side plates is for directly clipping the two side parts thereof respectively.
2. The heat sink clip of claim 1 , wherein each bend is located in between a top edge and a bottom edge of the chip.
3. The heat sink clip of claim 1 , wherein a ratio of a distance between one of the bends and a top edge of the chip of the memory module to a distance between the top edge and a bottom edge of the chip ranges from 15% to 40%.
4. The heat sink clip of claim 3 , wherein multiple air vents are at the top portion of each side plate.
5. The heat sink clip of claim 1 , wherein the top portions of the two side plates are bent directly at the two opposite side edges of the top plate.
6. The heat sink clip of claim 1 , wherein each of the two side plates forms an acute angle with the top plate.
7. The heat sink clip of claim 1 , wherein a degree of an inward incline of the inwardly inclined portion of each of the two side plates is higher than a degree of an inward incline of the top portion of a corresponding one of the two side plates.
8. A heat sink clip for clipping a memory module that has a top part and two side parts, and spreading heat away from a chip of the memory module, wherein the heat sink clip is made from a flexible heat-conductive metal plate formed by bending, and comprises:
a top plate having a top surface, a planar bottom surface and two opposite side edges, wherein a straight indent is at the top surface and is parallel to the two opposite side edges of the top plate; and
two side plates facing opposite from each other and each having an inwardly inclined portion and a lead, wherein the inwardly inclined portions of the two side plates directly extend from the two opposite side edges of the top plate, respectively, and incline inwardly, wherein a distance between joints of the inwardly inclined portions of the two side plates and the two opposite side edges of the top plate is equal to a thickness of the memory module, wherein the two leads directly extend from bottoms of the two inwardly inclined portions, respectively, and incline outwardly;
wherein the planar bottom surface of the top plate is for facing the top part of the memory module, and the two side plates is for directly clipping the two side parts thereof respectively.
9. The heat sink clip of claim 8 , wherein multiple air vents are at the two inwardly inclined portions, wherein the air vents at the two inwardly inclined portions are separate from the chip of the memory module after the heat sink clip clips the memory module.
10. The heat sink clip of claim 8 , wherein the inwardly inclined portion of the two side plates are bent directly at the two opposite side edges of the top plate.
11. The heat sink clip of claim 8 , wherein each of the two side plates forms an acute angle with the top plate.