Method of encapsulating a micro-device by anodic bonding
View Patent ↗A method for encapsulating at least one micro-device, comprising at least the following steps: bonding a face of a first substrate comprising at least one material impermeable to noble gases, in contact with a second substrate comprising glass and with a thickness of about 300 μm or more; etching at least one cavity through the second substrate such that side walls of the cavity are at least partly formed by remaining portions of the second substrate and that an upper wall of the cavity is formed by part of said face of the first substrate; anodic bonding of the remaining portions of the second substrate in contact with a third substrate in which the micro-device is formed, such that the micro-device is encapsulated in the cavity.
1. A method for encapsulating at least one micro-device, comprising at least the following steps:
bonding a face of a first substrate comprising at least one material impermeable to noble gases, in contact with a second substrate comprising glass and with a thickness of about 300 μm or more;
etching at least one cavity through the second substrate such that side walls of the cavity are at least partly formed by remaining portions of the second substrate and that an upper wall of the cavity is formed by part of said face of the first substrate;
anodic bonding of the remaining portions of the second substrate in contact with a third substrate in which the micro-device is formed, such that the micro-device is encapsulated in the cavity.
2. The method according to claim 1 , in which the material impermeable to noble gases is silicon, and/or the glass in the second substrate is of the borosilicate type.
3. The method according to claim 1 , also comprising a step prior to anodic bonding, to produce a getter material on the part of said face of the first substrate and/or on at least part of the side walls of the cavity and/or on at least part of the third substrate intended to be arranged in the cavity.
4. The method according to claim 1 , also comprising thinning of the second substrate, between the step of bonding the first substrate in contact with the second substrate and the step of etching the cavity, to a thickness greater than or equal to about 10 μm.
5. The method according to claim 1 , also comprising a step to make at least a portion of material impermeable to noble gases at least in contact with the side walls of the cavity, between the step of etching the cavity and the anodic bonding step.
6. The method according to claim 5 , in which the portion of material impermeable to noble gases comprises at least a metal and/or silicon.
7. The method according to claim 5 , in which the portion of material impermeable to noble gases also covers the upper wall of the cavity.
8. The method according to claim 5 , in which the portion of material impermeable to noble gases forms a layer also in contact with the remaining portions of the second substrate, anodic bonding of the remaining portions of the second substrate in contact with the third substrate being carried out between the portion of material impermeable to noble gases and the third substrate.
9. The method according to claim 1 , in which said method performs collective encapsulation of several micro-devices in distinct cavities, and also comprises a cutting step to provide a cut-out in at least the first substrate and the third substrate after anodic bonding of the remaining portions of the second substrate in contact with the third substrate, such that each of the encapsulated micro-devices forms a chip.
10. The method according to claim 9 , also comprising, after the cutting step, a step of depositing at least one layer of material impermeable to noble gases in contact with at least external side walls of the remaining portions of the second substrate.