Method for manufacturing semiconductor device, and semiconductor device
A method according to the invention has a bonding process of mounting a semiconductor chip on an upper surface of a die pad that has the upper surface whose area is larger than a reverse side of the semiconductor chip. It also has a sealed body formation process of sealing the semiconductor chip so that an undersurface opposite to the upper surface of the die pad may be exposed after the bonding process. Here, the upper surface of the die pad is arranged around an area over which the semiconductor chip is mounted, and has a hollow part arrangement area in which a groove or multiple holes are formed. Moreover, surface roughness of the upper surface is made coarser than surface roughness of the undersurface.
1. A semiconductor device, comprising:
a die pad that has a first plane and a second plane located on the opposite side of the first plane;
a plurality of leads arranged next to the die pad;
a semiconductor chip that has a surface, a plurality of electrodes formed over the surface, and a reverse side located on the opposite side of the surface, and is mounted over a chip mounting area of the first plane of the die pad;
a plurality of first wires that electrically couple one part of the electrodes of the semiconductor chip and the leads;
a second wire that electrically couples the other part of the electrodes of the semiconductor chip and the die pad; and
a sealed body that seals the semiconductor chip, the first wires, and the second wire so that a part of each of the leads and the second plane of the die pad may be exposed,
wherein an area of the first plane of the die pad is larger than an area of the reverse side of the semiconductor chip,
wherein the first plane of the die pad comprises the chip mounting area, a first bonding area that is located between the chip mounting area and the leads and to which the second wire is bonded, and a first hollow part arrangement area that is arranged between the first binding area and the chip mounting area and in which a groove or a plurality of holes are formed, and
wherein surface roughness of the first plane in the chip mounting area, the first bonding area, and the first hollow part arrangement area is coarser than surface roughness of the second plane.
2. The semiconductor device according to claim 1 ,
wherein over the second plane of the die pad, a stepped part that ranges to a side face of the die pad and a groove part arranged between the central part and the stepped part of the second plane of the die pad are provided.
3. The semiconductor device according to claim 2 ,
wherein a depth of the groove part is deeper than a depth of the stepped part.
4. The semiconductor device according to claim 3 ,
wherein the first hollow part arrangement area is arranged at a position nearer to the side face of the die pad than the groove part is.
5. The semiconductor device according to claim 1 ,
wherein the first plane of the die pad further comprises a second hollow part arrangement area that is arranged between the first bonding area and the peripheral part of the die pad and in which a groove or a plurality of holes are formed.
6. The semiconductor device according to claim 5 ,
wherein the holes are formed in each of the first and the second hollow part arrangement areas, respectively, and
wherein a second wire is bonded to an area surrounded by the holes.
7. The semiconductor device according to claim 1 ,
wherein the holes are formed in the first hollow part arrangement area, and an arrangement space of the adjacent holes is equal to or less than twice an opening size of each of the holes.
8. The semiconductor device according to claim 1 ,
wherein the groove is formed in the first hollow part arrangement area.
9. The method for manufacturing a semiconductor device according to claim 1 ,
wherein, expressing the surface roughness of the first plane as ratio (Sr) of the surface area of the roughened surface to an unit area of a flat surface, Sr is equal to or more than 1.2.