Monitoring testkey used in semiconductor fabrication
A monitoring testkey for a wafer is provided. The monitoring testkey includes a first metal oxide semiconductor (MOS) transistor having a channel extending in a first direction, a second MOS transistor having a channel extending in a second direction, a common gate pad electrically connected to gate electrodes of the first MOS transistor and the second MOS transistor, a first source pad electrically connected to source electrodes of the first MOS transistor and the second MOS transistor, a first drain pad electrically connected to a drain electrode of the first MOS transistor, and a second drain pad electrically connected to a drain electrode of the second MOS transistor. The monitoring testkey helps to improve the critical dimension uniformity and electrical characteristics uniformity of elements in a wafer.
1. A monitoring testkey, formed in a wafer, the monitoring testkey comprising:
a first metal oxide semiconductor (MOS) transistor, a channel of the first MOS transistor extending in a first direction;
a second MOS transistor, a channel of the second MOS transistor extending in a second direction;
a common gate pad, electrically connected to a gate electrode of the first MOS transistor and a gate electrode of the second MOS transistor;
a first source pad, electrically connected to a source electrode of the first MOS transistor and a source electrode of the second MOS transistor;
a first drain pad, electrically connected to a drain electrode of the first MOS transistor; and
a second drain pad, electrically connected to a drain electrode of the second MOS transistor.
2. The monitoring testkey of claim 1 , wherein the first direction is parallel to the second direction.
3. The monitoring testkey of claim 1 , wherein the first direction is orthogonal to the second direction.
4. The monitoring testkey of claim 3 , further comprising:
a third MOS transistor, a channel of the third MOS transistor extending in the first direction, and a drain electrode of the third MOS transistor being electrically connected to the first drain pad;
a fourth MOS transistor, a channel of the fourth MOS transistor extending in the second direction, a drain electrode of the fourth MOS transistor being electrically connected to the second drain pad, a gate electrode of the third MOS transistor and a gate electrode of the fourth MOS transistor being electrically connected to the common gate pad; and
a second source pad, electrically connected to a source electrode of the third MOS transistor and the fourth MOS transistor.
5. The monitoring testkey of claim 4 , wherein the first MOS transistor and the second MOS transistor are of a first conductivity type, and the third MOS transistor and the fourth MOS transistor are of a second conductivity type.
6. The monitoring testkey of claim 1 , wherein the monitoring testkey is repeatedly formed in a plurality of chips in the wafer.
7. The monitoring testkey of claim 6 , wherein the monitoring testkey is repeatedly formed at four corners of each of the chips.
8. The monitoring testkey of claim 6 , wherein the monitoring testkey is repeatedly and uniformly distributed in the each of the chips.
9. The monitoring testkey of claim 6 , wherein the monitoring testkey is repeatedly formed at a center of each of the chips.