Semiconductor packages
Semiconductor package are provided. In one embodiment, the semiconductor package may include a substrate such as a circuit substrate, a semiconductor chip mounted on the circuit substrate, a molding (or an encapsulant) covering the semiconductor chip and the circuit substrate and including a first temperature control member, and a heat dissipation member covering the molding.
1. A semiconductor package comprising:
a substrate;
a semiconductor chip mounted on the substrate;
a molding covering the semiconductor chip and the substrate, and including one or more first temperature control members, wherein the one or more first temperature control members have a particle shape, and the one or more first temperature control members are surrounded by a capsule made of a conductive material; and
a heat dissipation member covering the molding.
2. The semiconductor package of claim 1 , wherein the one or more first temperature control members include a phase change material.
3. The semiconductor package of claim 1 , wherein the one or more first temperature control members comprise:
a first material of which phase transition occurs at a first temperature; and
a second material of which phase transition occurs at a second temperature different from the first temperature.
4. The semiconductor package of claim 1 , wherein the molding further includes a plurality of thermally conductive particles scattered in the one or more first temperature control members.
5. The semiconductor package of claim 1 , wherein the one or more first temperature control members have a particle shape, and
the one or more first temperature control members are scattered in the molding.
6. The semiconductor package of claim 1 , the molding further includes a plurality of porous material sections being separated from each other,
each of the porous material sections has a pore, the one or more first temperature control members each have a particle shape, and
the one or more first temperature control members are disposed in the pores of the porous material sections.
7. The semiconductor package of claim 1 , the molding further includes a porous material having pores,
the one or more first temperature control members have a particle shape, and
the one or more first temperature control members are disposed in one of the pores.
8. The semiconductor package of claim 1 , wherein the molding includes a plurality of spaces being separated from each other, and each of the spaces is filled with the one or more first temperature control members.
9. The semiconductor package of claim 1 , wherein the molding includes a space having a zigzag shape, and the space is filled with the one or more first temperature control members.
10. The semiconductor package of claim 1 , further comprising: an adhesive adhering the heat dissipation member to the molding and the substrate, wherein the heat dissipation member includes metal.
11. The semiconductor package of claim 1 , further comprising: one or more second temperature control members disposed in the heat dissipation member.
12. A semiconductor package comprising:
a circuit substrate;
a semiconductor chip mounted on the circuit substrate;
a molding covering the semiconductor chip and the circuit substrate, and including one or more first temperature control members;
a heat dissipation member covering the molding;
first solder balls electrically interconnecting the circuit substrate and the semiconductor chip;
an under filler covering the first solder balls and filling a space between the circuit substrate and the semiconductor chip;
second solder balls disposed on a bottom surface of the circuit substrate;
one or more second temperature control members disposed in each of the first solder balls; and
one or more third temperature control members disposed in each of the second solder balls.
13. The semiconductor package of claim 12 , wherein the one or more second temperature control members are agglomerated in a central region of each of the first solder balls,
each of the first solder balls surrounding a respective one of the one or more second temperature control members,
the one or more third temperature control members are agglomerated in a central region of each of the second solder balls, and
each of the second solder balls surrounding a respective one of the one or more third temperature control members.
14. The semiconductor package of claim 1 , further comprising:
a heat sink disposed between the semiconductor chip and the molding, and including cooling fins, wherein gap regions between the cooling fins are filled with the molding.
15. A semiconductor package comprising:
a substrate;
a semiconductor chip mounted on the substrate; and
an encapsulant encapsulating the semiconductor chip, the encapsulant including a plurality of temperature control members formed of a phase change material scattered therein, wherein the temperature control members have a particle shape, and the temperature control members are surrounded by a capsule made of a conductive material.
16. The semiconductor package of claim 15 , wherein the plurality of temperature control members include at least one of paraffin (C 20 ˜C 45 ), mineral, salt hydrate, carboxylic acid, sugar alcohol, di-n-alkylammonium salt having alkyl groups different from each other, or combinations thereof.