Method for pattern formation, method and composition for resist underlayer film formation, and resist underlayer film
Provided by the present invention is a method including: (1) forming a resist underlayer film on the upper face side of a substrate to be processed using a composition for forming a resist underlayer film, the composition containing (A) a compound having a group represented by the following formula (1); (2) forming a resist coating film by applying a resist composition on the resist underlayer film; (3) exposing the resist coating film by selectively irradiating the resist coating film with a radiation; (4) forming a resist pattern by developing the exposed resist coating film; and (5) forming a predetermined pattern on the substrate to be processed by sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask.
1. A method for forming a pattern, the method comprising:
(1) forming a resist underlayer film on the upper face side of a substrate to be processed using a composition for forming a resist underlayer film, the composition comprising a polymer comprising a structural unit derived from (A) a compound comprising a group represented by the following formula (1):
wherein, in the formula (1), R represents a monovalent organic group having 1 to 30 carbon atoms, the monovalent organic group represented by R does not include an oxygen atom at the end of the side adjacent the sulfur atom, and * represents a bonding hand;
(2) forming a resist coating film by applying a resist composition on the resist underlayer film;
(3) exposing the resist coating film by selectively irradiating the resist coating film with a radiation;
(4) forming a resist pattern by developing the exposed resist coating film; and
(5) forming a predetermined pattern on the substrate to be processed by sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask,
wherein the compound (A) comprises at least one ring selected from the group consisting of an aromatic ring and a heteroaromatic ring, and the bonding hand denoted by * in the group represented by the above formula (1) bonds via an oxygen atom with the aromatic ring or the heteroaromatic ring.
2. The method for forming a pattern according to claim 1 , further comprising after the step of (1) forming a resist underlayer film and prior to the step of (2) forming a resist coating film, a step of:
(1′) forming an intermediate layer on the upper face side of the resist underlayer film, and wherein
in the step of forming a pattern (5), the intermediate layer is further dry etched.
3. The method for forming a pattern according to claim 1 , wherein R in the above formula (1) represents at least one group selected from the set consisting of an aryl group which may have a substituent and a heteroaryl group which may have a substituent.
4. The method for forming a pattern according to claim 1 , wherein the compound (A) comprises a partial structure represented by the following formula (2):
wherein, in the formula (2), Q represents a partial structure consisting of an aromatic ring or a heteroaromatic ring; R is as defined in the above formula (1); Y represents an oxygen atom; n0 is an integer of 1 or greater; R 1 represents a monovalent organic group; m0 is an integer of 0 or greater; and provided that the number of R, Y or R 1 is more than one, each R, each Y and each R 1 may be the same or different.
5. The method for forming a pattern according to claim 1 , wherein the polymer is at least one resin selected from the group consisting of a novolak resin, a resol resin, a styrene resin, an acenaphthylene resin and a polyarylene resin.
6. The method for forming a pattern according to claim 1 , wherein the composition for forming a resist underlayer film further comprises (B) a solvent.
7. The method for forming a pattern according to claim 1 , wherein the resist underlayer film is an organic film.
8. A method for forming a resist underlayer film comprising:
(1) forming a coated film by applying a composition for forming a resist underlayer film, the composition comprising a polymer comprising a structural unit derived from (A) a compound comprising a group represented by the following formula (1) on a substrate to be processed; and
(2) forming a resist underlayer film by heating the coated film,
wherein, in the formula (1), R represents a monovalent organic group having 1 to 30 carbon atoms, the monovalent organic group represented by R does not include an oxygen atom at the end of the side adjacent the sulfur atom, and * represents a bonding hand,
wherein the compound (A) comprises at least one ring selected from the group consisting of an aromatic ring and a heteroaromatic ring, and the bonding hand denoted by * in the group represented by the above formula (1) bonds via an oxygen atom with the aromatic ring of the heteroaromatic ring.
9. The method for forming a resist underlayer film according to claim 8 , wherein the resist underlayer film is an organic film.