Electrochemical etching apparatus

1. An electrochemical etching apparatus, comprising:

a power supply including a negative terminal and a positive terminal configured to output current;

a container configured to contain an electrolyte;

a cathode coupled to the container and configured to fluidly communicate with the electrolyte, the cathode having a portion electrically connected to the negative terminal; and

an anode having a portion electrically connected to the positive terminal, the anode including a graphene layer and a metal substrate layer that is etched from the graphene layer in response to the current flowing through the anode, the anode further including a metal plate having a first portion in electrical communication with the positive terminal to receive the current; and

an electrically conductive polymer comprising Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) configured to couple the metal plate to the graphene layer.

2. The electrochemical etching apparatus of claim 1 , wherein a first surface of the graphene layer is disposed on an upper surface of the metal substrate layer, and the metal substrate layer is configured to fluidly communicate with the electrolyte.

3. The electrochemical etching apparatus of claim 2 , wherein the anode further comprises a metal plate having a first portion in electrical communication with the output of the power supply to receive the current.

4. The electroplating etching apparatus of claim 1 , wherein the current density at the anode ranges from 2-200 mA/cm 2 .

5. The electrochemical etching apparatus of claim 4 , wherein the metal substrate layer comprises copper (Cu).

6. The electrochemical etching apparatus of claim 1 , wherein the electrolyte is a solution of sulfuric acid (H 2 SO 4 ).

7. The electrochemical etching apparatus of claim 1 , wherein the electrolyte is a solution comprising chloride (Cl) and an electrolyte metal.

8. The electrochemical etching apparatus of claim 7 , wherein the electrolyte metal is matched to the metal substrate layer of the anode.

9. The electrochemical etching apparatus of claim 8 , wherein the cathode comprises a metal configured to receive the metal substrate layer of the anode, the metal substrate transferred from the graphene layer to the cathode via electrodeposition in response to current flowing through the anode.

10. The electrochemical etching apparatus of claim 9 , wherein the metal is matched to the metal substrate layer of the anode.

11. An anode configured to electrically communicate with an electrochemical etching apparatus, the anode comprising:

a graphene layer including a first surface and a second surface opposite the first surface;

a metal substrate layer contacting the first surface and configured to electrically transfer from the graphene layer to a cathode in fluid communication with an electrolyte in response to a current flowing through the anode;

an electrically conductive polymer comprising Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), the electrically conductive polymer formed on the second surface of the graphene layer; and

a metal plate having a first portion in electrical communication with the electrically conductive polymer and a second portion in electrical communication with an output of a power supply to receive the current.

12. The anode of claim 11 , wherein the first surface of the graphene layer is disposed on an upper surface of the metal substrate layer, and the metal substrate layer is configured to fluidly communicate with the electrolyte.

13. The anode of claim 12 , wherein a size of the metal plate is matched to a size of at least one of the graphene layer and the metal substrate layer.

14. The anode of claim 11 further comprising a wire coupled to the metal plate and configured to electrically communicate with the output of the power supply to receive the current.

15. The anode of claim 11 , wherein the metal plate is formed of a metal comprising at least one of gold, copper, silver and tin.