Multilayered ceramic electronic component and board for mounting the same
There is provided a multilayered ceramic electronic component including a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces, first and second end surfaces, and first and second side surfaces, a plurality of first and second internal electrodes, and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, include first and second head parts formed on the first and second end surfaces, and first and second band parts formed on the first and second main surfaces, and are not formed on the first and second side surfaces.
1. A multilayered ceramic electronic component comprising:
a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction;
a plurality of first and second internal electrodes disposed in the ceramic body so as to be alternately exposed through the first and second end surfaces, having the dielectric therebetween; and
first and second external electrodes electrically connected to the first and second internal electrodes, respectively,
wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, respectively, include first and second head parts formed on the first and second end surfaces, respectively, and first and second band parts formed on the first and second main surfaces, respectively, and are not formed on the first and second side surfaces.
2. The multilayered ceramic electronic component of claim 1 , wherein L/W>1.0 is satisfied.
3. The multilayered ceramic electronic component of claim 1 , wherein the first and second internal electrodes are stacked in the thickness direction of the ceramic body.
4. The multilayered ceramic electronic component of claim 1 , wherein the first and second internal electrodes are stacked in the width direction of the ceramic body.
5. The multilayered ceramic electronic component of claim 1 , wherein when an average thickness of the dielectric layer is td, 0.1 μm≦td≦0.6 μm is satisfied.
6. The multilayered ceramic electronic component of claim 1 , wherein a thickness of each of the first and second internal electrodes is 0.6 μm or less.
7. The multilayered ceramic electronic component of claim 1 , wherein the number of stacked dielectric layers is 500 and more.
8. A multilayered ceramic electronic component comprising:
a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second end surfaces opposing each other in a length direction and first and second side surfaces opposing each other in a width direction;
a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the first and second end surfaces, having the dielectric therebetween;
first and second external electrodes electrically connected to the first and second internal electrodes, respectively; and
insulation layers formed on the first and second side surfaces,
wherein the insulation layers cover regions of the first and second external electrodes formed on the first and second side surfaces.
9. The multilayered ceramic electronic component of claim 8 , wherein L/W>1.0 is satisfied.
10. The multilayered ceramic electronic component of claim 8 , wherein the first and second internal electrodes are stacked in a thickness direction of the ceramic body.
11. The multilayered ceramic electronic component of claim 8 , wherein the first and second internal electrodes are stacked in the width direction of the ceramic body.
12. The multilayered ceramic electronic component of claim 8 , wherein when an average thickness of the dielectric layer is td, 0.1 μm≦td≦0.6 μm is satisfied.
13. The multilayered ceramic electronic component of claim 8 , wherein a thickness of each of the first and second internal electrodes is 0.6 μm or less.
14. The multilayered ceramic electronic component of claim 8 , wherein the number of stacked dielectric layers is 500 and more.
15. A board for mounting a multilayered ceramic electronic component, the board comprising:
a printed circuit board having first and second electrode pads disposed thereon; and
a multilayered ceramic electronic component installed on the printed circuit board,
wherein the multilayered ceramic electronic component includes: a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a width thereof is W, and a thickness thereof is T, and having first and second main surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the first and second end surfaces, having the dielectric layer therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, and
wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, respectively, include first and second head parts formed on the first and second end surfaces, respectively, and first and second band parts formed on the first and second main surfaces, respectively, and are not formed on the first and second side surfaces.
16. A board for mounting a multilayered ceramic electronic component, the board comprising:
a printed circuit board having first and second electrode pads disposed thereon; and
a multilayered ceramic electronic component installed on the printed circuit board,
wherein the multilayered ceramic electronic component includes: a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a width thereof is W, and a thickness thereof is T, and having first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the first and second end surfaces, having the dielectric therebetween; first and second external electrodes electrically connected to the first and second internal electrodes, respectively; and insulation layers formed on the first and second side surfaces, and the insulation layers cover regions of the first and second external electrodes formed on the first and second side surfaces.