Real-time prognostic on downhole printed circuit board assembly of measurement-while-drilling/logging-while-drilling
A method and apparatus for estimating a time to failure of an electronic component used in a downhole environment is disclosed. A stress is applied to the electronic component to cause failure of a plurality of prognostic sensors associated with the electronic component, wherein the stress level at which a prognostic sensor fails is indicative of a stress level at which the electronic component fails. Failure times are obtained due to the applied stress for the plurality of prognostic sensors. A trend is determined from the obtained failure times of the prognostic sensors. The time of failure of the electronic component is estimated from the determined trend.
1. A method of estimating a time to failure of an electronic component used in a downhole environment, comprising:
applying a stress to cause failure of a plurality of prognostic sensors associated with the electronic component, wherein a stress level at which a prognostic sensor fails is related to a stress level at which the electronic component fails by an acceleration factor of the prognostic sensor, wherein an acceleration factor of at least one prognostic sensor is different than an acceleration factor of another of the plurality of prognostic sensors;
obtaining failure times of the plurality of prognostic sensors;
determining a plurality of failure points from the time of failure of the sensors and the acceleration factors of the sensors;
determining a trend from the plurality of failure points; and
estimating the time of failure of the electronic component from the determined trend.
2. The method of claim 1 , wherein acceleration factor of a prognostic sensor indicates a rate at which the prognostic sensor fails with respect to the rate at which the electronic component fails.
3. The method of claim 2 , wherein the acceleration factor is determined from a wear-out model.
4. The method of claim 1 , wherein applying the stress includes applying at least one of: (i) lateral vibration; (ii) stickslip; (iii) axial vibration; and (iv) temperature.
5. The method of claim 1 further comprising monitoring the stress level at which the prognostic sensor fails to obtain a stress profile.
6. The method of claim 5 further comprising relating the monitored stress level to a time parameter.
7. The method of claim 6 , wherein the time parameter is one of (i) a failure time of a prognostic sensor, (ii) a failure time of the electronic component, and (iii) a time to suspension of use of the electronic component.
8. The method of claim 5 further comprising creating a wear-out model of the electronic component from the obtained failure times and the obtained stress profiles.
9. The method of claim 1 , further comprising applying the stress at one of: (i) a downhole location; and (ii) a controlled testing environment.
10. The method of claim 1 , wherein the electronic component is a printed circuit board assembly.
11. An apparatus for estimating a time to failure of an electronic component in a downhole environment, comprising:
a plurality of prognostic sensors associated with the electronic component, wherein a selected prognostic sensor is configured to fail at a stress level indicative of a failure stress level of the electronic component and an acceleration factor of the selected prognostic sensor, wherein the acceleration factor of the selected prognostic sensor is different that acceleration factor for another of the plurality of prognostic sensors; and
a processor configured to:
obtain failure times of the prognostic sensors,
determine a plurality of failure points from the failure times of the prognostic sensors and the acceleration factors of the prognostic sensors;
determine a trend from the plurality of failure points, and
estimate the time of failure of the electronic component from the determined trend.
12. The apparatus of claim 11 , wherein the acceleration factor is determined from a wear-out model.
13. The apparatus of claim 11 , wherein the applied stress includes at least one of: (i) lateral vibration; (ii) stickslip; (iii) axial vibration; and (iv) temperature.
14. The apparatus of claim 11 further comprising a measurement sensor configured to monitor a stress level at the electronic component, wherein the processor is further configured to obtain a stress profile from the monitored stress level.
15. The apparatus of claim 14 wherein the processor is further configured to relate the monitored stress level to a time parameter.
16. The apparatus of claim 15 , wherein the time parameter is one of: (i) a failure time of a prognostic sensor; (ii) a failure time of the electronic component, and (iii) a time to suspension of use of the electronic component.
17. The apparatus of claim 14 wherein the processor is further configured to create a wear-out model of the electronic component from the obtained failure times and the obtained stress profiles.
18. The apparatus of claim 11 , wherein the stress is applied via one of: (i) placing the electronic component in a downhole location; and (ii) operating a stress simulator coupled to the electronic component.
19. The apparatus of claim 11 , wherein the electronic component is a printed circuit board assembly.