Waveguide interposer substrate having first and second conversion structures on opposed waveguide surfaces
A waveguide includes: a waveguide portion including a first surface and a second surface that are opposed to each other; a first transmission line provided on the first surface of the waveguide portion; a second transmission line provided on the second surface of the waveguide portion; and a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.
1. A waveguide, comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line on the first surface of the waveguide portion;
a second transmission line on the second surface of the waveguide portion;
a first conversion structure through which a signal from the first transmission line to the waveguide portion can be input and converted; and
a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal,
wherein,
the waveguide portion includes a pair of conductive films that are opposed to each other, a plurality of conductive pillars that connect the pair of conductive films together, and a pair of conductor walls that are disposed to opposed to each other between the pair of conductive films, and
the first conversion structure and the second conversion structure each comprise a through electrode.
2. The waveguide according to claim 1 , wherein the first transmission line, the second transmission line, or both of the first transmission line and the second transmission line comprises a microstrip line.
3. The waveguide according to claim 1 , wherein the first conversion structure and the second conversion structure each comprise a tapered microstrip.
4. A waveguide, comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line on the first surface of the waveguide portion;
a second transmission line on the second surface of the waveguide portion;
a first conversion structure through which a signal from the first transmission line to the waveguide portion can be input and converted; and
a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal,
wherein,
the waveguide portion includes a pair of conductive films that are opposed to each other, and a pair of conductor walls that are opposed to each other between the pair of conductive films.
5. A waveguide, comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line on the first surface of the waveguide portion;
a second transmission line on the second surface of the waveguide portion;
a first conversion structure through which a signal from the first transmission line to the waveguide portion can be input and converted; and
a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal,
wherein,
the waveguide portion includes a pair of conductive films that are opposed to each other, and a plurality of conductive pillars that connect the pair of conductive films together.
6. A waveguide, comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line on the first surface of the waveguide portion;
a second transmission line on the second surface of the waveguide portion;
a first conversion structure through which a signal from the first transmission line to the waveguide portion can be input and converted; and
a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal,
wherein,
the first conversion structure and the second conversion structure each comprise a through electrode.
7. An electronic apparatus with an interposer substrate, a semiconductor chip, and a mounted substrate, the interposer substrate being provided with a waveguide in an insulating substrate, the semiconductor chip being mounted on the interposer substrate, and the mounted substrate being electrically connected with the interposer substrate, the waveguide comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line on the first surface of the waveguide portion;
a second transmission line on the second surface of the waveguide portion;
a first conversion structure through which a signal from the first transmission line to the waveguide portion can be input and converted; and
a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal,
wherein,
the waveguide portion includes a pair of conductive films that are opposed to each other, a plurality of conductive pillars that connect the pair of conductive films together, and a pair of conductor walls that are disposed to opposed to each other between the pair of conductive films, and
the first conversion structure and the second conversion structure each comprise a through electrode.
8. An interposer substrate with an insulating substrate and a waveguide provided in the substrate, the waveguide comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line on the first surface of the waveguide portion;
a second transmission line on the second surface of the waveguide portion;
a first conversion structure through which a signal from the first transmission line to the waveguide portion can be input and converted; and
a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal,
wherein,
the waveguide portion includes a pair of conductive films that are opposed to each other, a plurality of conductive pillars that connect the pair of conductive films together, and a pair of conductor walls that are disposed to opposed to each other between the pair of conductive films, and
the first conversion structure and the second conversion structure each comprise a through electrode.
9. The interposer substrate according to claim 8 , wherein the substrate comprises any one of: a high-resistance silicon substrate having a resistivity of about 1000 Ω·cm or higher; a low-temperature co-fired ceramic; a glass; quartz; and a ceramic.
10. A module with an interposer substrate and a semiconductor chip, the interposer substrate being provided with a waveguide in an insulating substrate, and the semiconductor chip being mounted on the interposer substrate, the waveguide comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line on the first surface of the waveguide portion;
a second transmission line on the second surface of the waveguide portion;
a first conversion structure through which a signal from the first transmission line to the waveguide portion can be input and converted; and
a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal,
wherein,
the waveguide portion includes a pair of conductive films that are opposed to each other, a plurality of conductive pillars that connect the pair of conductive films together, and a pair of conductor walls that are disposed to opposed to each other between the pair of conductive films, and
the first conversion structure and the second conversion structure each comprise a through electrode.