Technique for processing a substrate
Techniques for processing a substrate are disclosed. In one exemplary embodiment, the technique may be realized as a method for processing a substrate, the method comprising: ionizing first material and second material in an ion source chamber of an ion source, the first material being boron (B) containing material, the second material being one of phosphorous (P) containing material and arsenic (As) containing material; generating first ions containing B and second ions containing one of P and As; and extracting the first and second ions from the ion source chamber and directing the first and second ions toward the substrate.
1. A method for processing a substrate, the method comprising:
ionizing first material and second material in an ion source chamber of an ion source, the first material being boron (B) containing material, the second material being one of phosphorous (P) containing material and arsenic (As) containing material;
generating first ions containing B and second ions containing one of P and As; and
extracting the first and second ions from the ion source chamber and directing the first and second ions toward the substrate, wherein one of the first and second materials is provided as a solid source in the ion source chamber and the other one of the first and second material is provided as a gas released into the ion source chamber.
2. The method according to claim 1 , wherein the solid source is disposed on an ion source chamber wall of the ion source chamber.
3. The method according to claim 1 , wherein the ion source further comprises a dielectric window and RF source, wherein the solid source is disposed on the dielectric window.