Cleaning agent for semiconductor substrate, cleaning method using the cleaning agent, and method for producing semiconductor element
A cleaning agent for a semiconductor substrate, which is capable of exerting cleaning power equivalent to that of an SPM cleaning agent, greatly improving damage of a semiconductor substrate by the SPM cleaning agent, and efficiently stripping and removing impurities adhered to the surface of the semiconductor substrate, particularly attached substances such as an ion-implanted resist, a cleaning method using the cleaning agent, and a method for producing a semiconductor element are provided. The cleaning agent for a semiconductor substrate comprises sulfuric acid, hydrogen peroxide and an alkylene carbonate. The method for cleaning a semiconductor substrate comprises cleaning the semiconductor substrate with sulfuric acid, hydrogen peroxide and an alkylene carbonate in combination.
1. A cleaning agent for a semiconductor substrate, comprising sulfuric acid, hydrogen peroxide and an alkylene carbonate,
the amount of sulfuric acid is from 5% by mass to 50% by mass in terms of 98 mass % sulfuric acid aqueous solution, based on the total mass of the cleaning agent, and
the amount of hydrogen peroxide is from 5% by mass to 50% by mass in terms of 30 mass % hydrogen peroxide solution, based on the total mass of the cleaning agent.
2. The cleaning agent for a semiconductor substrate according to claim 1 , wherein the alkylene carbonate is ethylene carbonate or propylene carbonate.
3. The cleaning agent for a semiconductor substrate according to claim 1 , wherein the alkylene carbonate is used in an amount of from 10 to 95% by mass based on the total mass of the cleaning agent.
4. The cleaning agent for a semiconductor substrate according to claim 1 , wherein the cleaning agent is a multi-component kit comprising a combination of sulfuric acid, hydrogen peroxide and the alkylene carbonate.
5. The cleaning agent for a semiconductor substrate according to claim 1 , wherein the cleaning agent is a two-component kit comprising a mixture of hydrogen peroxide and the alkylene carbonate, and sulfuric acid.
6. The cleaning agent for a semiconductor substrate according to claim 1 , further comprising a sulfonate group-containing compound.
7. The cleaning agent for a semiconductor substrate according to claim 5 , wherein the mixture further comprises a sulfonate group-containing compound.