IP Library Granted Patent US 9,084,354
Granted Patent B2
US 9,084,354 · App. 13/597,152 · Granted Jul 14, 2015

Method of manufacturing a substrate having a voltage switchable dielectric material

Inventors: Robert Fleming (San Jose, CA); Lex Kosowsky (San Jose, CA); Shurui Shang (San Jose, CA); Bhret Graydon (San Jose, CA); Xiaofeng Chen (San Jose, CA); Glen Irvin (San Jose, CA)
Assignee: LITTELFUSE, INC.
H05K1/0259H05K1/0271H05K1/036H05K1/0373H05K3/0005H05K2201/068H05K2201/0738H05K2201/09136Y10T29/4913Y10T29/49117Y10T29/49124Y10T29/49155Y10T156/10
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Quick Facts
Patent No.
US 9,084,354
App. No.
13/597,152
Granted
Jul 14, 2015
Kind
B2
Abstract

A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Claims (14)

1. A method for manufacturing a printed circuit board (PCB), the method comprising:

coating a voltage switchable dielectric material on a copper foil;

curing the voltage switchable dielectric material;

forming an arcuate portion of the copper foil from the curing; and

attaching the arcuate portion of the copper foil to a layer of the PCB.

2. The method of claim 1 , further comprising:

coating a second voltage switchable dielectric material on a second copper foil;

curing the second voltage switchable dielectric material;

forming an arcuate portion of the second copper foil from the curing; and

attaching the arcuate portion of the second copper foil to a layer of the PCB.

3. The method of claim 2 , further comprising applying pressure to the first and second voltage switchable dielectric materials.

4. The method of claim 3 , wherein applying pressure to the first and second voltage switchable dielectric materials renders the first and second voltage switchable dielectric materials into a planar configuration.

5. The method of claim 1 , further comprising choosing a first design for a printed circuit board comprising one or more prepreg layers.

6. The method of claim 1 , further comprising creating an electrostatic discharge (ESD)-protected design.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2014
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 032123/0747 →
SECURITY AGREEMENT Recorded Dec 27, 2012
From: SHOCKING TECHNOLOGIES, INC.
To: LITTELFUSE, INC.
Reel/Frame 029548/0603 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2012
From: FLEMING, ROBERT; KOSOWSKY, LEX; SHANG, SHURUI; GRAYDON, BHRET; CHEN, XIAOFENG; IRVIN, GLEN
To: SHOCKING TECHNOLOGIES, INC.
Reel/Frame 029526/0282 →
Continuity (4)
Continuation 13009802 · Jan 19, 2011
Continuation In Part 12694702 · Jan 27, 2010
Provisional Application 61147730 · Jan 27, 2009
Related Publication 20120318569A1 · Dec 20, 2012