Sparsely-bonded CMOS hybrid imager
A method and device for imaging or detecting electromagnetic radiation is provided. A device structure includes a first chip interconnected with a second chip. The first chip includes a detector array, wherein the detector array comprises a plurality of light sensors and one or more transistors. The second chip includes a Read Out Integrated Circuit (ROIC) that reads out, via the transistors, a signal produced by the light sensors. A number of interconnects between the ROIC and the detector array can be less than one per light sensor or pixel.
1. A device structure, comprising:
a first chip comprising a detector array, the detector array comprising a plurality of pixels disposed in rows and columns, each of the pixels including a light sensor and transistors, and the transistors comprising a buffer transistor, a select transistor, and a reset transistor;
interconnects having a number corresponding to less than one of the interconnects per light sensor, including:
one or more reset interconnects including one reset interconnect per row of pixels, wherein the reset transistors in a same row are connected to a same one of the reset interconnects;
one or more select interconnects including one select interconnect per row of pixels, wherein the select transistors in a same row are connected to a same one of the select interconnects;
one or more common column interconnects including one common column interconnect per column of pixels, wherein one or more outputs of the select transistors in a same column are connected to a same one of the common column interconnects; and
a second chip interconnected with the first chip, wherein:
the interconnects interconnect the second chip with the first chip; and
the second chip comprises a Read Out Integrated Circuit (ROIC) that reads out one or more signals produced by the light sensors.
2. The device structure of claim 1 , wherein the first chip provides at least some multiplexing of the signals to create a multiplexed signal and the ROIC processes the multiplexed signal.
3. The device structure of claim 1 , wherein the device structure is an imager.
4. The device structure of claim 1 , wherein the detector array suppresses or prevents collection of signal charge by the transistors prior to collection of the signal charge by the light sensors.
5. The device structure of claim 1 , wherein the detector array further comprises:
a p-type doped semiconductor; and
one or more of p-type wells in the p-type doped semiconductor, wherein:
the p-type wells are more highly p-type doped than the surrounding p-type doped semiconductor; and
each of the transistors is formed in one of the p-type wells.
6. The device structure of claim 5 , wherein the light sensors are photodiodes and the detector array further comprises:
one or more n-type wells in the p-type doped semiconductor; wherein each of the photodiodes is made from a photodiode junction between the p-type doped semiconductor and one of the n-type wells.
7. The device structure of claim 5 , wherein the light sensors are photodiodes and the detector array further comprises:
one or more n + -type implants in the p-type doped semiconductor, wherein each of the photodiodes is made from a photodiode junction between the p-type doped semiconductor and one of the n + -implants.
8. The device structure of claim 5 , wherein a doping difference between the p-type well and the p-type doped semiconductor creates an electric field at a junction between the p-type doped semiconductor and the p-well that repels electrons created in the p-type doped semiconductor, preventing the electrons from being collected by n-type regions of the transistor.
9. The device structure of claim 1 , wherein:
a pitch of the pixels is smaller than a bond pitch of the interconnects.
10. The device structure of claim 1 , wherein:
the device structure forms a Hybrid Imager,
the ROIC is behind the detector array, and
the ROIC comprises signal and control processing but no buffer, reset, or select transistors.
11. A method of fabricating a device structure, comprising:
fabricating a first chip comprising a detector array, the detector array comprising a plurality of pixels disposed in rows and columns, each of the pixels including a light sensor and transistors, and the transistors comprising a buffer transistor, a select transistor, and a reset transistor;
forming interconnects having a number corresponding to less than one of the interconnects per light sensor, including:
one or more reset interconnects including one reset interconnect per row of pixels, wherein the reset transistors in a same row are connected to a same one of the reset interconnects;
one or more select interconnects including one select interconnect per row of pixels, wherein the select transistors in a same row are connected to a same one of the select interconnects;
one or more common column interconnects including one common column interconnect per column of pixels, wherein one or more outputs of the select transistors in a same column are connected to a same one of the common column interconnects; and
interconnecting a second chip with the first chip using the interconnects, the second chip comprising a Read Out Integrated Circuit (ROIC) that reads out one or more signals produced by the light sensors.
12. The method of claim 11 , wherein the device structure is an imager.
13. The method of claim 11 , further comprising fabricating the detector array to suppress or prevent collection of signal charge by the transistors prior to collection of the signal charge by the light sensors.
14. The method of claim 11 , wherein fabricating the detector array further comprises:
fabricating one or more p-type wells in a p-type doped semiconductor, wherein:
the p-type wells are more highly p-type doped than the surrounding p-type doped semiconductor; and
each of the transistors is formed in one of the p-type wells.
15. The method of claim 14 , wherein the light sensors are photodiodes and fabricating the detector array further comprises:
fabricating one or more n-type wells in the p-type doped semiconductor; wherein each of the photodiodes is made from a photodiode junction between the p-type doped semiconductor and one of the n-type wells.
16. The method of claim 14 , wherein the light sensors are photodiodes and fabricating the detector array further comprises:
fabricating one or more n + -type implants in the p-type doped semiconductor, wherein each of the photodiodes is made from a photodiode junction between the p-type doped semiconductor and one of the n + -implants.
17. The method of claim 14 , wherein a doping difference between the p-type well and the p-type semiconductor creates an electric field at a junction between the p-type doped semiconductor and the p-well that repels electrons created in the p-type doped semiconductor, preventing the electrons from being collected by n-type regions of the transistor.
18. The method of claim 11 , further comprising fabricating a pitch of the pixels that is smaller than a bond pitch of the interconnects.
19. The method of claim 11 , further comprising:
forming the ROIC behind the detector array and wherein the device structure forms a Hybrid Imager.