Method of manufacturing organic light emitting display panel

1. A method of manufacturing an organic light emitting display panel, the method comprising:

forming a substrate having a luminescent region and a pad region;

forming a light emitting cell in the luminescent region and an organic pattern in the pad region;

forming a protective insulating film over the luminescent region and the pad region of the substrate;

bonding the substrate provided with the protective insulating film and a sealing substrate using an adhesive film formed in a region corresponding to the luminescent region;

cutting the bonded substrate provided with the protective insulating film and the sealing substrate into a plurality of unit panels to expose the pad region; and

subsequent to exposing the pad region, removing the protective insulating film and the organic pattern in the exposed pad region.

2. The method according to claim 1 , wherein the forming of the light emitting cell and the organic pattern comprises simultaneously forming the organic pattern and at least one of an organic light emitting layer of the light emitting cell and a bank insulating film defining the organic light emitting layer using the same material, wherein the organic pattern is separated from the at least one of the simultaneously formed organic light emitting layer and bank insulating film.

3. The method according to claim 1 , wherein the removing of the protective insulating film and the organic pattern in the exposed pad region comprises:

adhering an adhesive tape to the substrate;

removing the protective insulating film disposed in the pad region and adhered to the adhesive tape by peeling off the adhesive tape; and

removing the organic pattern of the pad region by immersing the entire substrate from which the protective insulating film is removed or the pad region in an etchant.

4. The method according to claim 3 , wherein the removing of the protective insulating film and the organic pattern in the exposed pad region further comprises irradiating ultrasonic waves to the pad region immersed in the etchant, the etchant comprising isopropyl alcohol.

5. The method according to claim 1 , wherein the removing of the protective insulating film and the organic pattern in the exposed pad region comprises:

adhering an adhesive tape to the substrate;

removing the protective insulating film disposed in the pad region and adhered to the adhesive tape by peeling off the adhesive tape;

immersing the entire substrate from which the protective insulating film is removed or the pad region in deionized water; and

removing the organic pattern of the pad region by irradiating ultrasonic waves to the pad region immersed in deionized water.

6. The method according to claim 1 , wherein the removing of the protective insulating film and the organic pattern in the exposed pad region comprises:

adhering an adhesive tape to the substrate;

removing the protective insulating film disposed in the pad region and adhered to the adhesive tape by peeling off the adhesive tape;

removing the protective insulating film in the pad region to which the adhesive tape is adhered by peeling-off the adhesive tape; and

evaporating the organic pattern by irradiating laser beams to the organic pattern of the pad region exposed by removal of the protective insulating film.

7. The method according to claim 6 , wherein the evaporating of the organic pattern by irradiating laser beams to the organic pattern of the pad region comprises evaporating the organic pattern using energy of the laser beams absorbed by pad electrodes having octagonal or circular shapes and formed in the pad region to remove the organic pattern.

8. The method according to claim 3 , wherein the adhesive tape is adhered to the substrate to protrude from at least one of a plurality of sides of the substrate.

9. The method according to claim 5 , wherein the adhesive tape is adhered to the substrate to protrude from at least one of a plurality of sides of the substrate.

10. The method according to claim 6 , wherein the adhesive tape is adhered to the substrate to protrude from at least one of a plurality of sides of the substrate.

11. The method according to claim 1 , wherein the removing of the protective insulating film and the organic pattern in the exposed pad region comprises:

immersing the entire substrate or the pad region in an etchant comprising isopropyl alcohol or deionized water after the cutting process; and

simultaneously removing the organic pattern of the pad region by irradiating ultrasonic waves to the pad region immersed in the etchant comprising isopropyl alcohol or deionized water and the protective insulating film formed on the organic pattern.

12. A method of manufacturing an organic light emitting display panel, the method comprising:

forming a substrate having a luminescent region and a pad region;

simultaneously forming an organic pattern in the pad region and at least one of an organic light emitting layer of a light emitting cell and a bank insulating film in the luminescent region, the bank insulating film defining the organic light emitting layer;

forming a protective insulating film over the luminescent region and the pad region of the substrate;

bonding the substrate provided with the protective insulating film and a sealing substrate using an adhesive film formed in a region corresponding to the luminescent region;

cutting the bonded substrate provided with the protective insulating film and the sealing substrate into a plurality of unit panels to expose the pad region; and

subsequent to exposing the pad region, removing the protective insulating film and the organic pattern in the exposed pad region.