Electronic textile and method of manufacturing an electronic textile

1. A method of manufacturing an electronic textile comprising the steps of:

providing a textile carrier comprising a plurality of conductor lines ( 6 a - b );

releasably attaching said textile carrier to a rigid support plate;

providing a conductive substance on said textile carrier in a pattern forming a plurality of sets of connection pads ( 5 a - b ) on said textile carrier, each set of connection pads defining a component placement position for placement of an electronic component, and each set of connection pads ( 5 a - b ) comprising a connection pad overlapping one of said conductor lines, said connection pad having a connection pad length (L cp ) in a direction parallel to said conductor line and a connection pad width (W cp ) in a direction perpendicular to said conductor line, wherein said connection pad width (W cp ) is at least one percent of an extension (W tc ) of said textile carrier in said direction perpendicular to the conductor line;

automatically placing electronic components at said component placement positions, whereby the connecting pads in the resulting structure are positioned between the corresponding conductor line and the electronic component;

curing said conductive substance to attach said electronic components to said textile carrier, thereby forming said electronic textile; and

removing said electronic textile from said rigid support plate.

2. The method according to claim 1 , wherein each of said electronic components has at least a first component pad ( 8 a ) having a component pad length ( 1 ) in a direction parallel to said conductor line ( 6 a ) and a component pad width (w) in a direction perpendicular to said conductor line ( 6 a ), and said connection pad width (W cp ) is at least equal to said component pad width (w) of the component pad ( 8 a ) to be connected to said connection pad ( 5 a )

wherein said automatically placing step comprises positioning said first component pad adjacent to said connection pad.

3. The method according to claim 2 , wherein said conductive substance is provided such that said connection pad length (L cp ) becomes at least equal to said component pad length (l).

4. The method according to claim 1 , wherein said rigid support plate is provided with reference markers ( 22 a - d ; 23 a - d ) for guiding placement of said textile carrier and for allowing alignment of the automatic placement equipment.

5. The method according to claim 1 , wherein said step of releasably attaching comprises the steps of: tensioning said textile carrier; and pressing said textile carrier against an adhesive layer provided on said rigid support plate.

6. The method according to claim 5 , wherein said rigid support plate comprises mutually spaced apart support plate apertures ( 31 a - d ), and wherein said step of releasably attaching comprises the steps of:

providing a rigid alignment arrangement comprising an alignment plate and mutually spaced apart alignment pins ( 27 a - d ) extending substantially perpendicularly from said alignment plate, said alignment pins being arranged to correspond to an arrangement of the support plate apertures ( 31 a - d ) of said rigid support plate;

tensioning said textile carrier and arranging said textile carrier on said rigid alignment plate such that said alignment pins penetrate said textile carrier;

aligning said rigid support plate to said alignment pins and sandwiching said textile carrier between the rigid support plate and the rigid alignment plate such that said textile carrier is releasably attached to the rigid support plate.

7. The method according to claim 1 , wherein said step of providing said conductive substance comprises the step of: dispensing conductive glue in said pattern.