Semiconductor stacked body, method for manufacturing same, and semiconductor element
A method for manufacturing a semiconductor stacked body, and a semiconductor element including the semiconductor stacked body includes a semiconductor stacked body, including a Ga 2 O 3 substrate having, as a principal plane, a plane on which oxygen atoms are arranged in a hexagonal lattice, an AlN buffer layer formed on the Ga 2 O 3 substrate, and a nitride semiconductor layer formed on the AlN buffer layer.
1. A semiconductor laminate, comprising:
a Ga 2 O 3 substrate comprising a principal surface in which oxygen atoms are arranged in a hexagonal lattice pattern;
an AlN buffer layer on the Ga 2 O 3 substrate; and
a nitride semiconductor layer on the AlN buffer layer,
wherein the AlN buffer layer has a thickness of not less than 1 nm and not more than 5 nm and is formed under a temperature condition of not more than 500° C. by epitaxially growing an AlN crystal on the Ga 2 O 3 substrate.
2. The semiconductor laminate according to claim 1 , wherein the principal surface of the Ga 2 O 3 substrate comprises any one of (101), (−201), (301) and (3-10) planes.
3. The semiconductor laminate according to claim 2 , wherein the principal surface of the Ga 2 O 3 substrate comprises a (101) plane.
4. The semiconductor laminate according to claim 1 , wherein the AlN buffer layer has a thickness of not less than 2 nm and not more than 3 nm.
5. The semiconductor laminate according to claim 1 , wherein the nitride semiconductor layer comprises a GaN layer.
6. The semiconductor laminate according to claim 1 , wherein a voltage drop in a thickness direction thereof is not more than 0.6V.
7. The semiconductor laminate according to claim 1 , wherein the nitride semiconductor layer comprises a high Si concentration region formed in a region on a side of the AlN buffer layer and having a Si concentration of not less than 5×10 18 /cm 3 .
8. The semiconductor laminate according to claim 7 , wherein the high Si concentration region has a thickness of not less than 2 nm.
9. The semiconductor laminate according to claim 1 , wherein the principal surface of the Ga 2 O 3 substrate comprises one of (−201), (301), and (3-10) planes.
10. The semiconductor laminate according to claim 1 , wherein the principal surface of the Ga 2 O 3 substrate comprises any of (−201), (301), and (3-10) planes.
11. The semiconductor laminate according to claim 1 , wherein the AlN buffer layer is formed by the epitaxially growing of the AlN crystal on the Ga 2 O 3 substrate comprising a principal surface in which oxygen atoms are arranged in the hexagonal lattice pattern under the temperature condition of not more than 500° C.
12. A semiconductor element, comprising a semiconductor laminate comprising:
a Ga 2 O 3 substrate comprising a principal surface in which oxygen atoms are arranged in a hexagonal lattice pattern;
an AlN buffer layer on the Ga 2 O 3 substrate; and
a nitride semiconductor layer on the AlN buffer layer,
wherein an electric current is fed in a direction of a thickness of the semiconductor laminate, and
wherein the AlN buffer layer has a thickness of not less than 1 nm and not more than 5 nm and is formed under a temperature condition of not more than 500° C. by epitaxially growing an AlN crystal on the Ga 2 O 3 substrate.
13. The semiconductor element according to claim 12 , wherein the principal surface of the Ga 2 O 3 substrate comprises any one of (101), (−201), (301) and (3-10) planes.
14. The semiconductor element according to claim 12 , wherein the principal surface of the Ga 2 O 3 substrate comprises one of (−201), (301), and (3-10) planes.
15. The semiconductor element according to claim 12 , wherein the principal surface of the Ga 2 O 3 substrate comprises any of (−201), (301), and (3-10) planes.
16. The semiconductor element according to claim 12 , wherein the AlN buffer layer is formed by the epitaxially growing of the AlN crystal on the Ga 2 O 3 substrate comprising a principal surface in which oxygen atoms are arranged in the hexagonal lattice pattern under the temperature condition of not more than 500° C.
17. A method of manufacturing a semiconductor laminate, the method comprising:
forming an AlN buffer layer by epitaxially growing an AlN crystal on a Ga 2 O 3 substrate comprising a principal surface in which oxygen atoms are arranged in a hexagonal lattice pattern under a temperature condition of not more than 500° C.; and
forming a nitride semiconductor layer by growing a nitride semiconductor crystal on the AlN buffer layer,
wherein the AlN buffer layer is adapted to have a thickness of not less than 1 nm and not more than 5 nm.
18. The method of manufacturing a semiconductor laminate according to claim 17 , wherein the nitride semiconductor crystal comprises a GaN crystal.