Camera module
There is provided a camera module including: a lens barrel including at least one lens disposed on an optical axis; a housing having the lens barrel disposed therein; a circuit board disposed below the housing; and a shield-can coupled to the housing and enclosing an outer surface of the housing, wherein the circuit board is provided with a ground pad, and a contact surface of the shield-can contacting the ground pad is formed to have a convex-concave shape.
1. A camera module, comprising:
a lens barrel including at least one lens disposed on an optical axis;
a housing having the lens barrel disposed therein;
a circuit board disposed below the housing; and
a shield-can coupled to the housing and enclosing an outer surface of the housing,
wherein the circuit board is provided with a ground pad, and
a contact surface of the shield-can contacting the ground pad is formed to have a convex-concave shape,
wherein the ground pad and the contact surface of the shield-can have a conductive bond provided therebetween, and
wherein a convex portion of the contact surface of the shield-can contacts the ground pad, and a concave portion of the contact surface of the shield-can contacts the conductive bond.
2. The camera module of claim 1 , wherein the shield-can is coupled to the housing while a convex portion of the contact surface of the shield-can presses the ground pad.
3. A camera module, comprising:
a lens barrel including at least one lens disposed on an optical axis;
a housing having the lens barrel disposed therein;
a circuit board disposed below the housing; and
a shield-can coupled to the housing and enclosing an outer surface of the housing,
wherein the circuit board is provided with a ground pad, and
a contact surface of the shield-can contacting the ground pad is formed to have a convex-concave shape,
wherein the ground pad and the contact surface of the shield-can have a conductive bond provided therebetween, and
wherein a convex portion of the contact surface of the shield-can penetrates through the conductive bond and directly contacts the ground pad.
4. The camera module of claim 1 , wherein a convex portion of the contact surface of the shield-can has a pointed end.
5. The camera module of claim 1 , wherein the circuit board is disposed below the housing so as to be protruded outwardly of the housing, and
the ground pad is disposed on a portion of the circuit board protruded outwardly of the housing.
6. The camera module of claim 5 , wherein an inner surface of the shield-can encloses the outer surface of the housing, and
a lower surface of the shield-can contacts the ground pad.
7. A camera module, comprising:
a lens barrel including at least one lens disposed on an optical axis;
a housing having the lens barrel disposed therein;
a circuit board disposed below the housing; and
a shield-can coupled to the housing and enclosing an outer surface of the housing,
wherein the circuit board is provided with a ground pad, and
a contact surface of the shield-can contacting the ground pad is provided with a protrusion protruded to the ground pad,
wherein the ground pad and the contact surface of the shield-can have a conductive bond provided therebetween, and
wherein the protrusion contacts the ground pad, and
a remaining portion of the contact surface of the shield-can except for the protrusion contacts the conductive bond.
8. The camera module of claim 7 , wherein the protrusion comprises a plurality of protrusions spaced apart from each other by a predetermined interval.
9. The camera module of claim 7 , wherein the protrusion has a rounded end.
10. The camera module of claim 7 , wherein the protrusion has a triangular prism shape having a pointed end.