Polishing apparatus
A polishing apparatus includes: a pure water supply line configured to supply deaerated pure water into the polishing apparatus; a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to produce gas-dissolved pure water; a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure water; an ultrasonic cleaning unit coupled to the gas-dissolved pure water delivery line and configured to impart an ultrasonic vibration energy to the gas-dissolved pure water, which has been delivered through the gas-dissolved pure water delivery line, and then eject the gas-dissolved pure water onto an object to be cleaned; and a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit.
1. A polishing apparatus, comprising:
a pure water supply line configured to supply deaerated pure water into the polishing apparatus;
a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to produce gas-dissolved pure water;
a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure water;
an ultrasonic cleaning unit having a fluid passage coupled to the gas-dissolved pure water delivery line and configured to impart an ultrasonic vibration energy to the gas-dissolved pure water when flowing in the fluid passage, the fluid passage having a jet orifice oriented toward at least one of mechanisms of the polishing apparatus; and
a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit.
2. The polishing apparatus according to claim 1 , wherein the at least one of the mechanisms comprises a polishing pad provided in a polishing unit for polishing a substrate.
3. The polishing apparatus according to claim 1 , wherein the at least one of the mechanisms comprises a dresser configured to dress a polishing pad provided in a polishing unit for polishing a substrate.
4. The polishing apparatus according to claim 1 , wherein the at least one of the mechanisms comprises a polishing head having a membrane for pressing a substrate against a polishing pad to polish the substrate, the jet orifice is oriented toward the membrane, and the ultrasonic cleaning unit is configured to eject the gas-dissolved pure water through the jet orifice toward the membrane after the polishing head has released the substrate that has been polished.
5. The polishing apparatus according to claim 1 , wherein the at least one of the mechanisms comprises a polishing head having a membrane for pressing a substrate against a polishing pad to polish the substrate and a retaining ring surrounding the membrane, the jet orifice is oriented toward a gap between the membrane and the retaining ring, and the ultrasonic cleaning unit is configured to eject the gas-dissolved pure water through the jet orifice toward the gap after the polishing head has released the substrate that has been polished.
6. The polishing apparatus according to claim 1 , wherein the at least one of the mechanisms comprises a roll cleaning member for cleaning a substrate that has been polished and a cleaning plate that is to clean the roll cleaning member, and the jet orifice is oriented toward a contact area between the roll cleaning member and the cleaning plate.
7. The polishing apparatus according to claim 1 , wherein the at least one of the mechanisms comprises a pencil-type cleaning member for cleaning a substrate that has been polished and a cleaning plate that is to clean the pencil-type cleaning member, and the jet orifice is oriented toward a contact area between the pencil-type cleaning member and the cleaning plate.
8. The polishing apparatus according to claim 1 , wherein the at least one of the mechanisms comprises a roll rotating mechanism configured to rotate a roll cleaning member for cleaning a substrate that has been polished.