IP Library › Granted Patent US 9,162,464
Granted Patent B2
US 9,162,464 · App. 14/446,224 · Granted Oct 20, 2015

Liquid ejecting apparatus and wiping method

Inventor: Takashi Mano (Shiojiri, JP)
Assignee: Seiko Epson Corporation
B41J2/16538
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Quick Facts
Patent No.
US 9,162,464
App. No.
14/446,224
Granted
Oct 20, 2015
Kind
B2
Abstract

A liquid ejecting apparatus includes a liquid ejecting unit which includes a nozzle forming surface having nozzle openings for ejecting liquid formed thereon, a wiper which is contactably disposed on the nozzle forming surface, a movement unit which is able to relatively move the liquid ejecting unit and the wiper, and a control unit which controls the movement units such that an interference amount of the wiper and the nozzle forming surface in a position of the wiper which comes in contact with the liquid ejecting unit, is smaller than an interference amount of the wiper and the nozzle forming surface when the wiper is relatively moved through a nozzle region which is a region including the nozzle openings of the nozzle forming surface in a direction along the nozzle forming surface.

Claims (29)

1. A liquid ejecting apparatus comprising:

a liquid ejecting unit which includes a nozzle forming surface having nozzle openings for ejecting liquid formed thereon;

a wiper which is contactably disposed on the nozzle forming surface;

a first movement unit which is able to relatively move the liquid ejecting unit and the wiper in a first direction along the nozzle forming surface;

a second movement unit which is able to relatively move the liquid ejecting unit and the wiper in a second direction intersecting with the nozzle forming surface; and

a control unit which controls the first movement unit and the second movement unit,

wherein the control unit controls the first movement unit such that the wiper comes in contact with the nozzle forming surface after coming into contact with a side of the liquid ejecting unit, and the wiper is relatively moved from one end to the other end of the nozzle forming surface in the first direction while the wiper comes in contact with the nozzle forming surface, and

the control unit controls the second movement unit such that a first interference amount which is an interference amount of the wiper and the nozzle forming surface in the second direction in a position of the wiper which comes in contact with the side of the liquid ejecting unit, is smaller than a second interference amount which is an interference amount of the wiper and the nozzle forming surface in the second direction when the wiper is relatively moved through a nozzle region which is a region including the nozzle openings of the nozzle forming surface in the first direction.

2. The liquid ejecting apparatus according to claim 1 ,

wherein the control unit controls the second movement unit such that the interference amount of the wiper and the nozzle forming surface in the second direction is changed from the first interference amount to the second interference amount, between the one end and the nozzle region of the nozzle forming surface in the first direction.

3. The liquid ejecting apparatus according to claim 1 , further comprising:

a scraping unit which is disposed in the other end side of the nozzle forming surface of the liquid ejecting unit away from the nozzle forming surface in the first direction to scrape off the liquid adhered to the wiper by coming in contact with the wiper,

wherein the control unit controls the first movement unit such that the wiper is relatively moved to the scraping unit side in the first direction after the wiper passes through the other end of the nozzle forming surface in the first direction, and

the control unit controls the second movement unit such that the interference amount of the wiper and the nozzle forming surface in the second direction is changed to a third interference amount which is greater than the second interference amount, between the other end of the nozzle forming surface and the scraping unit in the first direction.

4. The liquid ejecting apparatus according to claim 1 ,

wherein the control unit controls the first movement unit such that relative movement of the liquid ejecting unit and the wiper in the first direction is stopped, between the one end and the nozzle region of the nozzle forming surface in the first direction, and then

the control unit controls the second movement unit such that the interference amount of the wiper and the nozzle forming surface in the second direction is changed from the first interference amount to the second interference amount.

5. A wiping method in which a liquid ejecting unit including a nozzle forming surface having nozzle openings for ejecting liquid formed thereon and a wiper are relatively moved to wipe the nozzle forming surface by sliding the wiper and the nozzle forming surface,

wherein a first interference amount which is an interference amount of the wiper and the nozzle forming surface in a position of the wiper which comes in contact with a side of the liquid ejecting unit before coming in contact with the nozzle forming surface, is smaller than a second interference amount which is an interference amount of the wiper and the nozzle forming surface when the wiper and a nozzle region which is a region including the nozzle openings of the nozzle forming surface are slid.

6. The wiping method according to claim 5 ,

wherein the first interference amount is changed to the second interference amount, between one end and the nozzle region of the nozzle forming surface in a direction along the nozzle forming surface.

7. The wiping method according to claim 5 ,

wherein a scraping unit is disposed in the other end side of the nozzle forming surface of the liquid ejecting unit away from the nozzle forming surface in a direction along the nozzle forming surface to scrape off the liquid adhered to the wiper by coming in contact with the wiper,

the wiper is relatively moved to the scraping unit side in the direction along the nozzle forming surface after the wiper passes through the other end of the nozzle forming surface in the direction along the nozzle forming surface, and

the interference amount of the wiper and the nozzle forming surface is changed to a third interference amount which is greater than the second interference amount, between the other end of the nozzle forming surface and the scraping unit in the direction along the nozzle forming surface.

8. The wiping method according to claim 5 ,

wherein relative movement of the liquid ejecting unit and the wiper is stopped, between the one end and the nozzle region of the nozzle forming surface in the direction along the nozzle forming surface, and then

the first interference amount is changed to the second interference amount.

9. The liquid ejecting apparatus according to claim 1 , wherein the movement of the liquid ejecting unit in the second direction causes the first and second interference amounts.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2014
From: MANO, TAKASHI
To: SEIKO EPSON CORPORATION
Reel/Frame 033416/0062 →
Priority Claims (1)
JP 2013-158649 · Jul 31, 2013 · national
Continuity (1)
Related Publication 20150035900A1 · Feb 5, 2015