Optical substrates having light collimating and diffusion structures

1. A method of forming an uneven structure on a substrate, comprising:

using a hard tool to penetrate into a mold to cut a plurality of trenches in an order on a surface of the mold through a control system, wherein the hard tool has a shape such that the transverse width of each trench increases as the penetrating depth of the hard tool increases, wherein cutting the plurality of trenches comprises:

cutting a first trench along a first direction by maintaining the position of the hard tool substantially along a first straight line in the first direction; and

cutting a second trench along the first direction by maintaining the position of the hard tool substantially along a second straight line parallel to the first straight line in the first direction, wherein the transverse width of the second trench controlled by the penetrating depth of the hard tool is increased enough to cut off the first trench along the transverse direction of the second trench such that the first trench is separated into a plurality of notches by the second trench; and

using the surface of the mold to emboss a thin film on the substrate to form the uneven structure on a substrate.

2. The method according to claim 1 , wherein each of the plurality of trenches has a first longitudinal axis between the opposing edges thereof.

3. The method according to claim 1 , wherein the substrate is an optical substrate having a light input surface and a light output surface, and the uneven structure is formed on the light input surface of the substrate.

4. The method according to claim 3 , wherein the uneven structure is a lenticular structure.

5. The method according to claim 3 , wherein the uneven structure is a prismatic structure.

6. The method according to claim 1 , wherein the substrate is an optical substrate having a light input surface and a light output surface, and the uneven structure is formed on the light output surface of the substrate.

7. The method according to claim 6 , wherein the uneven structure is a lenticular structure.

8. The method according to claim 6 , wherein the uneven structure is a prismatic structure.

9. The method according to claim 1 , wherein the control system is a CNC (Computer Numeric Control) machine and the mold is a roll.

10. The method according to claim 1 , wherein the first trenches that are not cut off corresponds to a plurality of segments of the uneven structure.

11. The method according to claim 10 , wherein at least one of the plurality of segments extends from an edge of the substrate to a point inside the surface area of the substrate.

12. The method according to claim 10 , wherein at least one of the plurality of segments extends from a first point inside the surface area of the substrate to a second point inside the surface area of the substrate.

13. The method according to claim 10 , wherein the surface of the plurality of segments of the uneven structure has roughed or textured structure for diffusion.

14. A method of forming an uneven structure on a substrate, comprising:

using a hard tool to penetrate into a mold to cut a plurality of trenches in an order on a surface of the mold through a control system, wherein the hard tool has a shape such that the transverse width of each trench increases as the penetrating depth of the hard tool increases, wherein cutting each set of a first trench and a second trench next to the first trench of the plurality of trenches comprises:

cutting the first trench along a first direction by maintaining the position of the hard tool substantially along a first straight line in the first direction; and

cutting the second trench along the first direction by maintaining the position of the hard tool substantially along a second straight line parallel to the first straight line in the first direction, wherein the transverse width of the second trench controlled by the penetrating depth of the hard tool is increased enough to cut off the first trench along the transverse direction of the second trench such that the first trench is separated into a plurality of notches by the second trench; and

using the surface of the mold excluding the last trench of the plurality of trenches to emboss a thin film on the substrate to form the uneven structure.

15. A method of mold making, comprising using a hard tool to penetrate into a mold to cut a plurality of trenches in an order on a surface of the mold through a control system, wherein the hard tool has a shape such that the transverse width of each trench increases as the penetrating depth of the hard tool increases, wherein cutting the plurality of trenches comprises:

cutting a first trench along a first direction by maintaining the position of the hard tool substantially along a first straight line in the first direction; and

cutting a second trench along the first direction by maintaining the position of the hard tool substantially along a second straight line parallel to the first straight line in the first direction, wherein the transverse width of the second trench controlled by the penetrating depth of the hard tool is increased enough to cut off the first trench along the transverse direction of the second trench such that the first trench is separated into a plurality of notches by the second trench.

16. A method of forming an optical film, comprising:

providing a substrate having a light input surface and a light output surface;

forming an uneven structure on the light input surface of the substrate for diffusing the light entering the optical film, wherein forming the uneven structure comprises:

using a hard tool to penetrate into a roll to cut a plurality of trenches in an order on a surface of the roll through a CNC (Computer Numeric Control) system, wherein each of the plurality of trenches is cut in a first direction, wherein when the plurality of trenches are cut, the hard tool is not pulled away from the roll, wherein the hard tool has a shape such that the transverse width of each trench increases as the penetrating depth of the hard tool increases, wherein cutting each set of a first trench and a second trench next to the first trench of the plurality of trenches comprises:

cutting the first trench along the first direction by maintaining the position of the hard tool substantially along a first straight line in the first direction; and

cutting the second trench along the first direction by maintaining the position of the hard tool substantially along a second straight line parallel to the first straight line in the first direction, wherein the transverse width of the second trench controlled by the penetrating depth of the hard tool is increased enough to cut off the first trench along the transverse direction of the second trench such that the first trench is separated into a plurality of notches by the second trench; and

using the surface of the mold excluding the last trench of the plurality of trenches to emboss a thin film on the substrate to form the uneven structure; and

forming a prismatic structure on a light output surface of the substrate.