Power semiconductor device capable of maintaining a withstand voltage
Disclosed herein is a power semiconductor device. The power semiconductor device includes a second conductive type first junction termination extension (JTE) layer that is formed so as to be in contact with one side of the second conductive type well layer, a second conductive type second JTE layer that is formed on the same line as the second conductive type first JTE layer, and is formed so as to be spaced apart from the second conductive type first JTE layer in a length direction of the substrate, and a poly silicon layer that is formed so as to be in contact with the second conductive type well layer and an upper portion of the second conductive type first JTE layer.
1. A power semiconductor device comprising:
a first conductive type drift layer that includes one surface and the other surface, and is divided into an active region, a connection region, and a termination region;
a second conductive type semiconductor substrate that is formed on the other surface of the first conductive type drift layer;
a second conductive type well layer that is formed with a predetermined depth in a thickness direction from the one surface of the first conductive type drift layer, and formed in the active region;
a second conductive type first junction termination extension (JTE) layer that is formed to be in contact with one side of the second conductive type well layer;
a second conductive type second JTE layer that is formed to be spaced apart from the second conductive type first JTE layer in a length direction of the substrate;
a first insulating layer that is formed to be in contact over an area from an upper portion of the second conductive type first JTE layer to an upper portion of the second conductive type second JTE layer;
a poly silicon layer that is formed above the second conductive type well layer and an upper portion of the second conductive type first JTE layer and is formed to be in contact with an arbitrary area among a side surface and an upper surface of the first insulating layer;
a trench that is formed to pass through the second conductive type well layer in a thickness direction from one surface of the first conductive type drift layer while including the second conductive type well layer; and
a second insulating layer that is formed on the second conductive type well layer on an inner side surface of the trench and the second conductive type first JTE layer while including an inner side surface of the trench,
wherein the second conductive type second JTE layer is formed longer than the second conductive type first JTE layer in the length direction of the substrate.
2. The power semiconductor device as set forth in claim 1 , wherein the second conductive type first JTE layer and the second conductive type second JTE layer have a concentration lower than the second conductive type well layer.
3. The power semiconductor device as set forth in claim 1 , wherein the poly silicon layer is formed so as to be closer to the second conductive type well layer rather than the second conductive type second JTE layer in the length direction of the substrate.
4. The power semiconductor device as set forth in claim 1 , further comprising:
a third electrode that is formed on a lower surface of the second conductive type semiconductor substrate.
5. The power semiconductor device as set forth in claim 1 , further comprising:
a first conductive type buffer layer that is formed between the first conductive type drift layer and the second conductive type semiconductor substrate.
6. The power semiconductor device as set forth in claim 1 , wherein the first conductive type is an N-type, and the second conductive type is a P-type.
7. The power semiconductor device as set forth in claim 1 , wherein the poly silicon layer is formed to be in contact with the side surface and the upper surface of the first insulating layer.
8. The power semiconductor device as set forth in claim 1 , further comprising:
a second electrode region that is formed on the second conductive type well layer and formed on both outer walls of the trench;
a third insulating layer that is formed on an upper portion of the trench and the poly silicon layer spaced apart from the upper portion of the trench in the length direction of the substrate, and includes an opening portion on the poly silicon layer; and
a second electrode that is formed above the one surface on the first conductive type drift layer and contacts the third insulating layer.
9. The power semiconductor device as set forth in claim 8 , further comprising:
a first electrode that includes an opening portion of the third insulating layer for forming the first electrode, and is formed on an arbitrary area of an upper portion of the third insulating layer.